Malik Shadab, Yiteng Xing, Jacques Noudem, Muralidhar Miryala
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Enhanced superconducting properties in bulk MgB2 through spark plasma sintering of ball-milled and sieved crystalline boron
In this study, in situ bulk MgB2 superconducting samples were sintered using spark plasma sintering (SPS) and characterized through various techniques, including X-ray diffraction (XRD), microstructure evaluation, and magnetization measurements. XRD analysis confirmed that MgB2 was the primary phase, with a secondary phase of MgO present in the sintered samples. Scanning electron microscopy (SEM) analysis revealed minimal porosity, and the bulk densities reached 95% of the theoretical value for MgB2, as calculated by mass volume. The samples exhibited remarkably high critical current densities (Jc), up to 405 kA/cm2 in self-field at 10 K, representing a 67% improvement over solid-state sintering. These high Jc values are attributed to the enhanced density of the bulk, which increases the superconducting area, which underscores the importance of density enhancement achieved through SPS and the MgB2 nanograins obtained via ball milling, and sieving of crystalline boron played a crucial role in this improvement.
期刊介绍:
The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.