交联单元对聚硅氧烷基材料耐热性和隔热性能的影响

IF 2.3 4区 化学 Q3 POLYMER SCIENCE
Kosuke Tsutsui, Hiroyuki Koga, Yohei Adachi, Joji Ohshita
{"title":"交联单元对聚硅氧烷基材料耐热性和隔热性能的影响","authors":"Kosuke Tsutsui, Hiroyuki Koga, Yohei Adachi, Joji Ohshita","doi":"10.1038/s41428-024-00953-2","DOIUrl":null,"url":null,"abstract":"<p>Heat insulators are key materials for efficient energy use and reduction of CO<sub>2</sub> emissions. Recently, we examined cross-linked polymethylsilsesquioxane (MSQ) for use as the basic structure of heat-resistant insulation materials. In this study, we prepared MSQs with different cross-linking units and examined the effects of their structures on the heat resistance and heat insulation properties. Among those, MSQ linked by diethynylbenzene had sufficiently low thermal diffusivity and moderately high heat resistance. We also showed their structure–thermal property relationships. Although other influencing factors could exist, the rigidity, π‒π interactions, and bulkiness of the cross-linking units were found to predominantly influence the thermal properties. These findings will lead to new molecular designs for polysilsesquioxane (PSQ)-based heat-resistant heat insulators with high performance.</p>","PeriodicalId":20302,"journal":{"name":"Polymer Journal","volume":"5 1","pages":""},"PeriodicalIF":2.3000,"publicationDate":"2024-08-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Effects of cross-linking units on the heat resistance and heat insulation properties of polysilsesquioxane-based materials\",\"authors\":\"Kosuke Tsutsui, Hiroyuki Koga, Yohei Adachi, Joji Ohshita\",\"doi\":\"10.1038/s41428-024-00953-2\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<p>Heat insulators are key materials for efficient energy use and reduction of CO<sub>2</sub> emissions. Recently, we examined cross-linked polymethylsilsesquioxane (MSQ) for use as the basic structure of heat-resistant insulation materials. In this study, we prepared MSQs with different cross-linking units and examined the effects of their structures on the heat resistance and heat insulation properties. Among those, MSQ linked by diethynylbenzene had sufficiently low thermal diffusivity and moderately high heat resistance. We also showed their structure–thermal property relationships. Although other influencing factors could exist, the rigidity, π‒π interactions, and bulkiness of the cross-linking units were found to predominantly influence the thermal properties. These findings will lead to new molecular designs for polysilsesquioxane (PSQ)-based heat-resistant heat insulators with high performance.</p>\",\"PeriodicalId\":20302,\"journal\":{\"name\":\"Polymer Journal\",\"volume\":\"5 1\",\"pages\":\"\"},\"PeriodicalIF\":2.3000,\"publicationDate\":\"2024-08-29\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Polymer Journal\",\"FirstCategoryId\":\"92\",\"ListUrlMain\":\"https://doi.org/10.1038/s41428-024-00953-2\",\"RegionNum\":4,\"RegionCategory\":\"化学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"POLYMER SCIENCE\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Polymer Journal","FirstCategoryId":"92","ListUrlMain":"https://doi.org/10.1038/s41428-024-00953-2","RegionNum":4,"RegionCategory":"化学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"POLYMER SCIENCE","Score":null,"Total":0}
引用次数: 0

摘要

隔热材料是高效利用能源和减少二氧化碳排放的关键材料。最近,我们研究了可用作耐热隔热材料基本结构的交联聚甲基硅倍半氧烷(MSQ)。在这项研究中,我们制备了具有不同交联单元的 MSQ,并考察了其结构对耐热性和隔热性能的影响。其中,由二乙炔苯连接的 MSQ 具有足够低的热扩散率和适度高的耐热性。我们还展示了它们的结构与热性能之间的关系。尽管可能存在其他影响因素,但我们发现交联单元的刚性、π-π 相互作用和体积是影响热性能的主要因素。这些发现将为基于聚硅氧烷(PSQ)的高性能耐热隔热材料带来新的分子设计。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Effects of cross-linking units on the heat resistance and heat insulation properties of polysilsesquioxane-based materials

Effects of cross-linking units on the heat resistance and heat insulation properties of polysilsesquioxane-based materials

Heat insulators are key materials for efficient energy use and reduction of CO2 emissions. Recently, we examined cross-linked polymethylsilsesquioxane (MSQ) for use as the basic structure of heat-resistant insulation materials. In this study, we prepared MSQs with different cross-linking units and examined the effects of their structures on the heat resistance and heat insulation properties. Among those, MSQ linked by diethynylbenzene had sufficiently low thermal diffusivity and moderately high heat resistance. We also showed their structure–thermal property relationships. Although other influencing factors could exist, the rigidity, π‒π interactions, and bulkiness of the cross-linking units were found to predominantly influence the thermal properties. These findings will lead to new molecular designs for polysilsesquioxane (PSQ)-based heat-resistant heat insulators with high performance.

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来源期刊
Polymer Journal
Polymer Journal 化学-高分子科学
CiteScore
5.60
自引率
7.10%
发文量
131
审稿时长
2.5 months
期刊介绍: Polymer Journal promotes research from all aspects of polymer science from anywhere in the world and aims to provide an integrated platform for scientific communication that assists the advancement of polymer science and related fields. The journal publishes Original Articles, Notes, Short Communications and Reviews. Subject areas and topics of particular interest within the journal''s scope include, but are not limited to, those listed below: Polymer synthesis and reactions Polymer structures Physical properties of polymers Polymer surface and interfaces Functional polymers Supramolecular polymers Self-assembled materials Biopolymers and bio-related polymer materials Polymer engineering.
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