Akihiko Teshigahara, Tetsuya Enomoto, Hideo Yamada and Shinya Yoshida
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Reduction mechanism of loss tangent of scandium-doped aluminum nitride thin film by post-deposition annealing
Scandium-doped aluminum nitride thin films are key materials for MEMS applications including bulk acoustic wave devices for communication. Although one drawback is the increase in the loss tangent with increasing Sc concentration, the loss tangent is reported to decrease after post-deposition annealing. However, the underlying mechanisms remain unclear. In this study, we propose the hypothesis that a low-resistivity thin layer near the surface of a substrate is one of the main reasons for the high loss tangent, and that annealing enhances the resistivity, eventually decreasing the loss tangent. The reasonability of the hypothesis was successfully confirmed by analyzing the frequency response of the loss tangent using an equivalent circuit with current–voltage characteristics, cathodoluminescence, etc. This achievement represents a significant step toward advanced methods for reducing the loss tangent and its application to other thin-film materials.
期刊介绍:
The Japanese Journal of Applied Physics (JJAP) is an international journal for the advancement and dissemination of knowledge in all fields of applied physics. JJAP is a sister journal of the Applied Physics Express (APEX) and is published by IOP Publishing Ltd on behalf of the Japan Society of Applied Physics (JSAP).
JJAP publishes articles that significantly contribute to the advancements in the applications of physical principles as well as in the understanding of physics in view of particular applications in mind. Subjects covered by JJAP include the following fields:
• Semiconductors, dielectrics, and organic materials
• Photonics, quantum electronics, optics, and spectroscopy
• Spintronics, superconductivity, and strongly correlated materials
• Device physics including quantum information processing
• Physics-based circuits and systems
• Nanoscale science and technology
• Crystal growth, surfaces, interfaces, thin films, and bulk materials
• Plasmas, applied atomic and molecular physics, and applied nuclear physics
• Device processing, fabrication and measurement technologies, and instrumentation
• Cross-disciplinary areas such as bioelectronics/photonics, biosensing, environmental/energy technologies, and MEMS