Jung-Hyun Park, Min-Seok Baek, Young-Kyun Kim, Jin-Hee Ham, Kee-Ahn Lee
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A Strategy for Simultaneous Increasement in the Strength-Ductility Balance of Directly-Quenched Ultra-High Strength Low Alloy Steel
This study investigated a strategy for simultaneous improving in the strength and ductility of the directly quenched ultra-high strength low alloy steel via low-temperature tempering. To stabilize the microstructure, sub-zero treatment was also employed at -73 °C for 30 min, and then tempering was performed for two types of temperature at 200 °C and 630 °C for 30 min. The microstructure of as-quenched steel consists of lath martensite and meta-stable retained austenite. After low temperature tempering (200 °C), some stable reverted austenite was formed at the austenite/martensite interface. When tempering was performed at high temperature (630 °C), the entire austenite remained as reverted austenite. In addition, Ti-rich carbides were observed at the martensite lath boundaries during tempering treatment. Tensile strength increased up to ∼ 1.8 GPa after low-temperature tempering, and ductility was also higher than that of as-quenched steel. In contrast, the steel which was tempered at 630 °C shows low mechanical properties compared to the as-quenched steel. Correlations between microstructure evolution (meta-stable to stable austenite transformation), mechanical properties and deformation behavior were also discussed and identified.
期刊介绍:
Metals and Materials International publishes original papers and occasional critical reviews on all aspects of research and technology in materials engineering: physical metallurgy, materials science, and processing of metals and other materials. Emphasis is placed on those aspects of the science of materials that are concerned with the relationships among the processing, structure and properties (mechanical, chemical, electrical, electrochemical, magnetic and optical) of materials. Aspects of processing include the melting, casting, and fabrication with the thermodynamics, kinetics and modeling.