{"title":"利用物理原位形成铜纳米颗粒的方法制造多孔表面铜颗粒并增强铜涂层之间的烧结结合力","authors":"Byeong Jo Han, Jong-Hyun Lee","doi":"10.1007/s12540-024-01790-x","DOIUrl":null,"url":null,"abstract":"<p>Cu particles with porous surface are fabricated and used as the paste fillers for rapid sintering. The particles are manufactured by the formation of Cu<sub>5</sub>Zn<sub>8</sub> on the surface of the Cu particles, followed by dezincification. The porous structure formed on the surface of the Cu particles collapses owing to external compression during sinter bonding and the in situ formation of Cu nanodebris, thereby enhancing the sinter-bondability. The sinter bonding was performed under 10 MPa at 300 °C in air. Higher shear strength was measured for the paste containing Cu particles with a porous surface compared to the identical sized spherical Cu particles at all bonding times. In particular, a near-full-density bondline was formed after bonding for 3 min and the shear strength increased to 15.85 MPa. When bonding was maintained for 10 min, an excellent shear strength of 20.17 MPa was obtained.</p><h3 data-test=\"abstract-sub-heading\">Graphical Abstract</h3>","PeriodicalId":703,"journal":{"name":"Metals and Materials International","volume":"279 1","pages":""},"PeriodicalIF":3.3000,"publicationDate":"2024-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Fabrication of Cu Particles with Porous Surface and Enhanced Sinter-Bondability between Cu Finishes by Physically In Situ Formation of Cu Nanoparticles Using Them\",\"authors\":\"Byeong Jo Han, Jong-Hyun Lee\",\"doi\":\"10.1007/s12540-024-01790-x\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<p>Cu particles with porous surface are fabricated and used as the paste fillers for rapid sintering. The particles are manufactured by the formation of Cu<sub>5</sub>Zn<sub>8</sub> on the surface of the Cu particles, followed by dezincification. The porous structure formed on the surface of the Cu particles collapses owing to external compression during sinter bonding and the in situ formation of Cu nanodebris, thereby enhancing the sinter-bondability. The sinter bonding was performed under 10 MPa at 300 °C in air. Higher shear strength was measured for the paste containing Cu particles with a porous surface compared to the identical sized spherical Cu particles at all bonding times. In particular, a near-full-density bondline was formed after bonding for 3 min and the shear strength increased to 15.85 MPa. When bonding was maintained for 10 min, an excellent shear strength of 20.17 MPa was obtained.</p><h3 data-test=\\\"abstract-sub-heading\\\">Graphical Abstract</h3>\",\"PeriodicalId\":703,\"journal\":{\"name\":\"Metals and Materials International\",\"volume\":\"279 1\",\"pages\":\"\"},\"PeriodicalIF\":3.3000,\"publicationDate\":\"2024-09-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Metals and Materials International\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://doi.org/10.1007/s12540-024-01790-x\",\"RegionNum\":3,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"MATERIALS SCIENCE, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Metals and Materials International","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1007/s12540-024-01790-x","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
Fabrication of Cu Particles with Porous Surface and Enhanced Sinter-Bondability between Cu Finishes by Physically In Situ Formation of Cu Nanoparticles Using Them
Cu particles with porous surface are fabricated and used as the paste fillers for rapid sintering. The particles are manufactured by the formation of Cu5Zn8 on the surface of the Cu particles, followed by dezincification. The porous structure formed on the surface of the Cu particles collapses owing to external compression during sinter bonding and the in situ formation of Cu nanodebris, thereby enhancing the sinter-bondability. The sinter bonding was performed under 10 MPa at 300 °C in air. Higher shear strength was measured for the paste containing Cu particles with a porous surface compared to the identical sized spherical Cu particles at all bonding times. In particular, a near-full-density bondline was formed after bonding for 3 min and the shear strength increased to 15.85 MPa. When bonding was maintained for 10 min, an excellent shear strength of 20.17 MPa was obtained.
期刊介绍：
Metals and Materials International publishes original papers and occasional critical reviews on all aspects of research and technology in materials engineering: physical metallurgy, materials science, and processing of metals and other materials. Emphasis is placed on those aspects of the science of materials that are concerned with the relationships among the processing, structure and properties (mechanical, chemical, electrical, electrochemical, magnetic and optical) of materials. Aspects of processing include the melting, casting, and fabrication with the thermodynamics, kinetics and modeling.
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