利用基于等离子体辅助分子束外延的超高真空沉积技术制造调制掺杂的 β-(AlxGa1-x)2O3/Ga2O3 三金属场效应晶体管并确定其特性

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
V. N. Senthil Kumaran, M. Venkatesh, Azath Mubarakali, Abdulrahman Saad Alqahtani, P. Parthasarathy
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引用次数: 0

摘要

本研究探讨了以β-Ga2O3为衬底材料的MOD-FET(调制掺杂场效应晶体管)的设计。主要重点是了解自加热对电子迁移率曲线变化的影响。本文引入了一个模型,该模型考虑了温度和掺杂对 β-Ga2O3 中电子迁移率的影响。此外,考虑到温度和晶体取向的影响,它还提供了对β-Ga2O3热传导率的估计。此外,我们还展示了一个使用三金属场效应晶体管的调制掺杂β-(AlxGa1-x)2O3/Ga2O3的实际例子,其中导带之间的能级差和阻挡层中存在的非期望通道决定了这种结构中的最大片载流子密度。这些通道使电子能从β-Ga2O3量子阱的底部和上部转移。通过调制掺杂,所提出的结构在环境温度下的极限漏电流为 250 mA/m,峰值电导率为 40 ms/m,电位为 10.0 V。通过使用 Atlas Silvaco TCAD 仿真分析性能,将 TMG 器件与双金属栅极 (DMG) 器件进行比较,评估了 TMG 器件的电气特性。结果表明,与 DMG 晶体管相比,所建议的器件在电导率、电流增益截止频率和能量增益截止频率方面表现出更高的效率。本例中测量到的电场是使用三金属栅结构 (TMG) 调节沟道的结果。所设计的装置在栅极长度为 0.2 毫米的情况下实现了 45.5/50.5 千兆赫的峰值频率。这一发现凸显了使用β-(AlxGa1-x)2O3/Ga2O3三金属场效应晶体管结构作为高功率射频操作方法的潜力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Fabrication and characterization of modulation-doped β-(AlxGa1−x)2O3/Ga2O3 tri-metal FET utilizing ultra-high vacuum deposition based on plasma-assisted molecular beam epitaxy

Fabrication and characterization of modulation-doped β-(AlxGa1−x)2O3/Ga2O3 tri-metal FET utilizing ultra-high vacuum deposition based on plasma-assisted molecular beam epitaxy

This study investigates the design of MOD-FETs (modulation-doped field effect transistors) using β-Ga2O3 as the substrate material. The main focus is on understanding the impact of self-heating on the alteration of mobility of electrons profile. This paper introduces a model that takes into account the influence on temperature and doping on the electron mobility in β-Ga2O3. Furthermore, it offers estimations for the conductivity of heat of β-Ga2O3, considering the influence of temperature and crystalline orientation. Furthermore, we showcase a practical example of modulation-doped β-(AlxGa1-x)2O3/Ga2O3 using a tri-metal FET where the energy level difference between the conduction bands and the presence of undesired channels in the barrier layer determines the maximum sheet carrier density in this structure. These channels enable the transfer of electrons from both the bottom and upper portions of the β-Ga2O3 quantum well. Using modulation doping, the proposed structure exhibited an ultimate current drain of 250 mA/m, a peak conductivity of 40 ms/m, and a potential of 10.0 V at ambient temperature. The electrical characteristics of the TMG device were evaluated by comparing it to the double-metal gate (DMG) device using the Atlas Silvaco TCAD simulation for analysis of performance. The results indicate that, the suggested device exhibits greater efficiency in terms of conductivity, current gain cut-off frequency, and energy gain cut-off frequency as compared to DMG transistors. The measured electric field in this example is a consequence of using a Tri-Metal Gate architecture (TMG) to regulate the channel. The designed setup achieves peak frequency of 45.5/50.5 gigahertz with a gate length of 0.2 mm. This discovery highlights the potential of using the β-(AlxGa1−x)2O3/Ga2O3 with tri-metal FET architecture as a promising method for high-power radio frequency operations.

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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