{"title":"通过添加 Sc 增强高导电率铜-铬合金的强度","authors":"Tao Huang, Chao-Min Zhang, Ying-Xuan Ma, Shu-Guo Jia, Ke-Xing Song, Yan-Jun Zhou, Xiu-Hua Guo, Zhen-Peng Xiao, Hui-Wen Guo","doi":"10.1007/s12598-024-02947-8","DOIUrl":null,"url":null,"abstract":"<div><p>A new Cu-Cr-Sc alloy was designed, prepared and subjected to deformation heat treatment. Transmission electron microscopy (TEM), electron backscatter diffraction (EBSD) and X-ray diffraction (XRD) were employed to investigate the effects of Sc on the microstructural changes in the Cu-Cr alloy in different states, examine the changes in the precipitates during aging, reveal the intrinsic correlation between the structure and property in the peak aging state, and evaluate the Sc distribution in the Cu-Cr alloy. The addition of Sc significantly increased the yield strength of the Cu-Cr alloy by ~ 24.6% after aging at 480 °C for 1 h, while it had a high electrical conductivity of 81.5% international annealed copper standard (IACS). This enhancement was attributed to the effective inhibition of Cr phase coarsening and recrystallization through the addition of Sc, which strengthened the alloy. Furthermore, in the Cu-Cr-Sc alloy, most of the Sc atoms precipitated as the Cu<sub>4</sub>Sc phase, with a small amount of Sc segregating at the grain boundaries to pin them. This grain boundary pinning helped to inhibit grain growth and further improve the strength. The main strengthening mechanisms identified in Cu-Cr-Sc alloys were dislocation strengthening and precipitation strengthening.</p><h3>Graphical abstract</h3>\n<div><figure><div><div><picture><source><img></source></picture></div></div></figure></div></div>","PeriodicalId":749,"journal":{"name":"Rare Metals","volume":"43 11","pages":"6054 - 6067"},"PeriodicalIF":9.6000,"publicationDate":"2024-09-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Enhanced strength of a high-conductivity Cu-Cr alloy by Sc addition\",\"authors\":\"Tao Huang, Chao-Min Zhang, Ying-Xuan Ma, Shu-Guo Jia, Ke-Xing Song, Yan-Jun Zhou, Xiu-Hua Guo, Zhen-Peng Xiao, Hui-Wen Guo\",\"doi\":\"10.1007/s12598-024-02947-8\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>A new Cu-Cr-Sc alloy was designed, prepared and subjected to deformation heat treatment. Transmission electron microscopy (TEM), electron backscatter diffraction (EBSD) and X-ray diffraction (XRD) were employed to investigate the effects of Sc on the microstructural changes in the Cu-Cr alloy in different states, examine the changes in the precipitates during aging, reveal the intrinsic correlation between the structure and property in the peak aging state, and evaluate the Sc distribution in the Cu-Cr alloy. The addition of Sc significantly increased the yield strength of the Cu-Cr alloy by ~ 24.6% after aging at 480 °C for 1 h, while it had a high electrical conductivity of 81.5% international annealed copper standard (IACS). This enhancement was attributed to the effective inhibition of Cr phase coarsening and recrystallization through the addition of Sc, which strengthened the alloy. Furthermore, in the Cu-Cr-Sc alloy, most of the Sc atoms precipitated as the Cu<sub>4</sub>Sc phase, with a small amount of Sc segregating at the grain boundaries to pin them. This grain boundary pinning helped to inhibit grain growth and further improve the strength. The main strengthening mechanisms identified in Cu-Cr-Sc alloys were dislocation strengthening and precipitation strengthening.</p><h3>Graphical abstract</h3>\\n<div><figure><div><div><picture><source><img></source></picture></div></div></figure></div></div>\",\"PeriodicalId\":749,\"journal\":{\"name\":\"Rare Metals\",\"volume\":\"43 11\",\"pages\":\"6054 - 6067\"},\"PeriodicalIF\":9.6000,\"publicationDate\":\"2024-09-04\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Rare Metals\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://link.springer.com/article/10.1007/s12598-024-02947-8\",\"RegionNum\":1,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"MATERIALS SCIENCE, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Rare Metals","FirstCategoryId":"88","ListUrlMain":"https://link.springer.com/article/10.1007/s12598-024-02947-8","RegionNum":1,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
Enhanced strength of a high-conductivity Cu-Cr alloy by Sc addition
A new Cu-Cr-Sc alloy was designed, prepared and subjected to deformation heat treatment. Transmission electron microscopy (TEM), electron backscatter diffraction (EBSD) and X-ray diffraction (XRD) were employed to investigate the effects of Sc on the microstructural changes in the Cu-Cr alloy in different states, examine the changes in the precipitates during aging, reveal the intrinsic correlation between the structure and property in the peak aging state, and evaluate the Sc distribution in the Cu-Cr alloy. The addition of Sc significantly increased the yield strength of the Cu-Cr alloy by ~ 24.6% after aging at 480 °C for 1 h, while it had a high electrical conductivity of 81.5% international annealed copper standard (IACS). This enhancement was attributed to the effective inhibition of Cr phase coarsening and recrystallization through the addition of Sc, which strengthened the alloy. Furthermore, in the Cu-Cr-Sc alloy, most of the Sc atoms precipitated as the Cu4Sc phase, with a small amount of Sc segregating at the grain boundaries to pin them. This grain boundary pinning helped to inhibit grain growth and further improve the strength. The main strengthening mechanisms identified in Cu-Cr-Sc alloys were dislocation strengthening and precipitation strengthening.
期刊介绍：
Rare Metals is a monthly peer-reviewed journal published by the Nonferrous Metals Society of China. It serves as a platform for engineers and scientists to communicate and disseminate original research articles in the field of rare metals. The journal focuses on a wide range of topics including metallurgy, processing, and determination of rare metals. Additionally, it showcases the application of rare metals in advanced materials such as superconductors, semiconductors, composites, and ceramics.
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