Jin-Hui Li, Dan Peng, Qiu-Hong Mou, Feng Wang, Yun-Qiao Ding
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Preparation of a New Single Component Silicone Resin and Its Application in Impregnating Varnish
In this paper, a new single component silicone resin with D-T structural components was prepared through two condensation processes. The design of the silicone resin structure is based on computational simulation by B3LYP functional method with the 6-31G (d) level. A new class- C insulating solvent-free silicone impregnating varnish based the new single component silicone resin was prepared. The solvent-free varnish can be cured under the influence of heat and platinum catalysis. We tested the viscosity-temperature characteristic of the impregnating varnish. We observed the stability of the impregnating varnish under different temperature. We analyzed the curing characteristics of the impregnating varnish by DSC and Moving Die Rheometer. The curing process of the impregnating varnish is determined as follow: first curing stage for 22 h at 190℃, and then the second curing stage for 2 h at 200℃.
期刊介绍：
The journal Silicon is intended to serve all those involved in studying the role of silicon as an enabling element in materials science. There are no restrictions on disciplinary boundaries provided the focus is on silicon-based materials or adds significantly to the understanding of such materials. Accordingly, such contributions are welcome in the areas of inorganic and organic chemistry, physics, biology, engineering, nanoscience, environmental science, electronics and optoelectronics, and modeling and theory. Relevant silicon-based materials include, but are not limited to, semiconductors, polymers, composites, ceramics, glasses, coatings, resins, composites, small molecules, and thin films.
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