{"title":"采用 90 纳米 SiGe BiCMOS 设计 64-GBaud 相干互阻抗放大器的信号完整性增强技术","authors":"Shuaizhe Ma;Nianquan Ran;Xi Liu;Yifei Xia;Songqin Xu;Wei Huang;Chen Tan;Jing Li;Zhenyu Yin;Shaoheng Lin;Jianhua Pan;Zhe Chen;Chaoxuan Zhang;Wu Wen;Quan Pan;Zhongming Xue;Xiaoyan Gui;Li Geng;Dan Li","doi":"10.1109/TCSI.2024.3450700","DOIUrl":null,"url":null,"abstract":"This paper presents signal integrity augmentation design techniques in a 64-GBaud transimpedance amplifier (TIA) for coherent optical communication. In the FE-TIA, a bonding wire ringing reduction technique and an input DC current cancellation (IDCC) loop adapted for coherent communication are proposed. In the post amplifiers, a group delay variation (GDV) friendly bandwidth boosting technique is proposed to achieve optimal time domain performance. A non-linearity cancellation technique and a high-linearity gain control approach are proposed in both circuit and system levels. These signal integrity augmentation techniques form a toolkit to solve the design challenges in bandwidth, linearity, GDV, ringing, offset, crosstalk, etc. in high-speed high-order modulation communication. Fabricated in a 90-nm SiGe BiCMOS technology, the TIA shows input-referred noise current density of 15.1 pA/\n<inline-formula> <tex-math>$\\surd $ </tex-math></inline-formula>\nHz, bandwidth of over 40 GHz with GDV less than ±3.75 ps. The TIA gain can be adjusted between \n<inline-formula> <tex-math>$150~\\Omega $ </tex-math></inline-formula>\n - 5 K\n<inline-formula> <tex-math>$\\Omega $ </tex-math></inline-formula>\n, which enables maximum overload input current of 3 mApp. The total harmonic distortion (THD) is less than 3% and the crosstalk between two channels is less than -3 dB. The chip consumes 264 mW from 3.3 V supply.","PeriodicalId":13039,"journal":{"name":"IEEE Transactions on Circuits and Systems I: Regular Papers","volume":"71 11","pages":"5221-5234"},"PeriodicalIF":5.2000,"publicationDate":"2024-09-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Signal Integrity Augmentation Techniques for the Design of 64-GBaud Coherent Transimpedance Amplifier in 90-nm SiGe BiCMOS\",\"authors\":\"Shuaizhe Ma;Nianquan Ran;Xi Liu;Yifei Xia;Songqin Xu;Wei Huang;Chen Tan;Jing Li;Zhenyu Yin;Shaoheng Lin;Jianhua Pan;Zhe Chen;Chaoxuan Zhang;Wu Wen;Quan Pan;Zhongming Xue;Xiaoyan Gui;Li Geng;Dan Li\",\"doi\":\"10.1109/TCSI.2024.3450700\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents signal integrity augmentation design techniques in a 64-GBaud transimpedance amplifier (TIA) for coherent optical communication. In the FE-TIA, a bonding wire ringing reduction technique and an input DC current cancellation (IDCC) loop adapted for coherent communication are proposed. In the post amplifiers, a group delay variation (GDV) friendly bandwidth boosting technique is proposed to achieve optimal time domain performance. A non-linearity cancellation technique and a high-linearity gain control approach are proposed in both circuit and system levels. These signal integrity augmentation techniques form a toolkit to solve the design challenges in bandwidth, linearity, GDV, ringing, offset, crosstalk, etc. in high-speed high-order modulation communication. Fabricated in a 90-nm SiGe BiCMOS technology, the TIA shows input-referred noise current density of 15.1 pA/\\n<inline-formula> <tex-math>$\\\\surd $ </tex-math></inline-formula>\\nHz, bandwidth of over 40 GHz with GDV less than ±3.75 ps. The TIA gain can be adjusted between \\n<inline-formula> <tex-math>$150~\\\\Omega $ </tex-math></inline-formula>\\n - 5 K\\n<inline-formula> <tex-math>$\\\\Omega $ </tex-math></inline-formula>\\n, which enables maximum overload input current of 3 mApp. The total harmonic distortion (THD) is less than 3% and the crosstalk between two channels is less than -3 dB. The chip consumes 264 mW from 3.3 V supply.\",\"PeriodicalId\":13039,\"journal\":{\"name\":\"IEEE Transactions on Circuits and Systems I: Regular Papers\",\"volume\":\"71 11\",\"pages\":\"5221-5234\"},\"PeriodicalIF\":5.2000,\"publicationDate\":\"2024-09-04\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Circuits and Systems I: Regular Papers\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10665896/\",\"RegionNum\":1,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Circuits and Systems I: Regular Papers","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10665896/","RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Signal Integrity Augmentation Techniques for the Design of 64-GBaud Coherent Transimpedance Amplifier in 90-nm SiGe BiCMOS
This paper presents signal integrity augmentation design techniques in a 64-GBaud transimpedance amplifier (TIA) for coherent optical communication. In the FE-TIA, a bonding wire ringing reduction technique and an input DC current cancellation (IDCC) loop adapted for coherent communication are proposed. In the post amplifiers, a group delay variation (GDV) friendly bandwidth boosting technique is proposed to achieve optimal time domain performance. A non-linearity cancellation technique and a high-linearity gain control approach are proposed in both circuit and system levels. These signal integrity augmentation techniques form a toolkit to solve the design challenges in bandwidth, linearity, GDV, ringing, offset, crosstalk, etc. in high-speed high-order modulation communication. Fabricated in a 90-nm SiGe BiCMOS technology, the TIA shows input-referred noise current density of 15.1 pA/
$\surd $
Hz, bandwidth of over 40 GHz with GDV less than ±3.75 ps. The TIA gain can be adjusted between
$150~\Omega $
- 5 K
$\Omega $
, which enables maximum overload input current of 3 mApp. The total harmonic distortion (THD) is less than 3% and the crosstalk between two channels is less than -3 dB. The chip consumes 264 mW from 3.3 V supply.
期刊介绍:
TCAS I publishes regular papers in the field specified by the theory, analysis, design, and practical implementations of circuits, and the application of circuit techniques to systems and to signal processing. Included is the whole spectrum from basic scientific theory to industrial applications. The field of interest covered includes: - Circuits: Analog, Digital and Mixed Signal Circuits and Systems - Nonlinear Circuits and Systems, Integrated Sensors, MEMS and Systems on Chip, Nanoscale Circuits and Systems, Optoelectronic - Circuits and Systems, Power Electronics and Systems - Software for Analog-and-Logic Circuits and Systems - Control aspects of Circuits and Systems.