{"title":"CZT 基底表面处理对退火过程中红外线透过率的影响","authors":"Chao Xu, Shangshu Li, Changhe Zhou","doi":"10.1007/s11664-024-11315-2","DOIUrl":null,"url":null,"abstract":"<p>The application of CdZnTe(CZT) crystals in infrared focal plane detectors and x-ray imaging detectors is hindered by the low infrared transmittance (IRT) and the presence of Cd/Te inclusions/precipitation. Over the preceding decades, strategies involving Cd vapor control during the growth process and substrate post-annealing have been posited to address these challenges. Presently, the prioritized approach is the utilization of substrate post-annealing, owing to the limited precision in comprehending the Cd-Te equilibrium and the intricacies associated with Cd vapor control technology. This study delves into the effect of the removed surface layer depth of a CZT and the selection of the (111) A-face or (111) B-face on IRT during Cd atmosphere annealing. It is recommended that a minimum of 60 <i>μ</i>m of the surface layer be eliminated using chemical mechanical polishing technology before annealing. Experimental findings further reveal that Cd atom diffusion from the (111) A-face results in an IRT enhancement of up to 60%, in stark contrast to the slight improvement observed with the (111) B-face after annealing. The mechanism of Cd atom diffusions affecting the IRT in the annealing process is discussed.</p>","PeriodicalId":626,"journal":{"name":"Journal of Electronic Materials","volume":"9 1","pages":""},"PeriodicalIF":2.2000,"publicationDate":"2024-08-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Effects of CZT Substrate Surface Treatment on IR-Transmittance in the Annealing Process\",\"authors\":\"Chao Xu, Shangshu Li, Changhe Zhou\",\"doi\":\"10.1007/s11664-024-11315-2\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<p>The application of CdZnTe(CZT) crystals in infrared focal plane detectors and x-ray imaging detectors is hindered by the low infrared transmittance (IRT) and the presence of Cd/Te inclusions/precipitation. Over the preceding decades, strategies involving Cd vapor control during the growth process and substrate post-annealing have been posited to address these challenges. Presently, the prioritized approach is the utilization of substrate post-annealing, owing to the limited precision in comprehending the Cd-Te equilibrium and the intricacies associated with Cd vapor control technology. This study delves into the effect of the removed surface layer depth of a CZT and the selection of the (111) A-face or (111) B-face on IRT during Cd atmosphere annealing. It is recommended that a minimum of 60 <i>μ</i>m of the surface layer be eliminated using chemical mechanical polishing technology before annealing. Experimental findings further reveal that Cd atom diffusion from the (111) A-face results in an IRT enhancement of up to 60%, in stark contrast to the slight improvement observed with the (111) B-face after annealing. The mechanism of Cd atom diffusions affecting the IRT in the annealing process is discussed.</p>\",\"PeriodicalId\":626,\"journal\":{\"name\":\"Journal of Electronic Materials\",\"volume\":\"9 1\",\"pages\":\"\"},\"PeriodicalIF\":2.2000,\"publicationDate\":\"2024-08-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Electronic Materials\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.1007/s11664-024-11315-2\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Electronic Materials","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1007/s11664-024-11315-2","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
摘要
CdZnTe (CZT) 晶体在红外焦平面探测器和 X 射线成像探测器中的应用受到红外透射率(IRT)低和镉/碲夹杂物/沉淀物存在的阻碍。在过去的几十年中,人们提出了在生长过程中控制镉蒸气和基片退火的策略来应对这些挑战。目前,由于对镉碲平衡的理解精度有限以及镉蒸气控制技术的复杂性,优先采用的方法是基片后退火。本研究深入探讨了在镉气氛退火过程中,CZT 的去除表面层深度以及 (111) A 面或 (111) B 面的选择对 IRT 的影响。建议在退火前使用化学机械抛光技术去除至少 60 μm 的表面层。实验结果进一步表明,镉原子从(111)A 面扩散会导致 IRT 增强高达 60%,这与退火后观察到的(111)B 面的轻微改善形成鲜明对比。本文讨论了退火过程中镉原子扩散影响 IRT 的机理。
Effects of CZT Substrate Surface Treatment on IR-Transmittance in the Annealing Process
The application of CdZnTe(CZT) crystals in infrared focal plane detectors and x-ray imaging detectors is hindered by the low infrared transmittance (IRT) and the presence of Cd/Te inclusions/precipitation. Over the preceding decades, strategies involving Cd vapor control during the growth process and substrate post-annealing have been posited to address these challenges. Presently, the prioritized approach is the utilization of substrate post-annealing, owing to the limited precision in comprehending the Cd-Te equilibrium and the intricacies associated with Cd vapor control technology. This study delves into the effect of the removed surface layer depth of a CZT and the selection of the (111) A-face or (111) B-face on IRT during Cd atmosphere annealing. It is recommended that a minimum of 60 μm of the surface layer be eliminated using chemical mechanical polishing technology before annealing. Experimental findings further reveal that Cd atom diffusion from the (111) A-face results in an IRT enhancement of up to 60%, in stark contrast to the slight improvement observed with the (111) B-face after annealing. The mechanism of Cd atom diffusions affecting the IRT in the annealing process is discussed.
期刊介绍:
The Journal of Electronic Materials (JEM) reports monthly on the science and technology of electronic materials, while examining new applications for semiconductors, magnetic alloys, dielectrics, nanoscale materials, and photonic materials. The journal welcomes articles on methods for preparing and evaluating the chemical, physical, electronic, and optical properties of these materials. Specific areas of interest are materials for state-of-the-art transistors, nanotechnology, electronic packaging, detectors, emitters, metallization, superconductivity, and energy applications.
Review papers on current topics enable individuals in the field of electronics to keep abreast of activities in areas peripheral to their own. JEM also selects papers from conferences such as the Electronic Materials Conference, the U.S. Workshop on the Physics and Chemistry of II-VI Materials, and the International Conference on Thermoelectrics. It benefits both specialists and non-specialists in the electronic materials field.
A journal of The Minerals, Metals & Materials Society.