描述输出力与激励电流之间关系的扭曲和盘绕聚合物致动器复合模型

IF 2.2 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Yawu Wang, Yue Zhang, Zhichao Xu, Peng Huang, Chun-Yi Su
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引用次数: 0

摘要

最近发现的扭曲盘绕聚合物致动器(TCPA)具有成本低、变形和受力大、能量密度高、寿命长、体积小、易于驱动等优点,在软体机器人领域显示出巨大的潜力。为了实现 TCPA 在软体机器人中的实际应用,有必要对其动态模型进行研究。然而,TCPA 具有明显的滞后非线性,这给其建模带来了障碍。虽然已经建立了一些 TCPA 的滞后模型,但对其随速率变化的滞后模型的研究仍然不足。为了解决这个问题,我们建立了一个复合模型,其中热力学模型是通过级联反冲模型和动态线性系统来建立的,以描述输出力和温度之间的关系。此外,还根据热力学第一定律建立了热电模型,其功能是描述温度与激励电流之间的关系。在复合模型的模型验证中,所有拟合度值均大于 87.949%。因此,该复合模型具有良好的泛化性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Compound Model of Twisted and Coiled Polymer Actuators Describing Relationship Between Output Force and Excitation Current

Compound Model of Twisted and Coiled Polymer Actuators Describing Relationship Between Output Force and Excitation Current

Recently discovered twisted and coiled polymer actuators (TCPAs) show huge potentials in the field of soft robots due to advantages of low cost, large deformation and force, high energy density, long life, compact size, and easy to drive. To realize practical applications of the TCPA in soft robots, the study on its dynamic modeling is necessary. However, the TCPA has an obvious hysteresis nonlinearity, bringing obstacles to its modeling. Although some hysteresis models for the TCPA have been established, the study on its rate-dependent hysteresis modeling is still insufficient. To address this issue, a compound model has been established, in which the thermomechanical model is developed by cascading the backlash-like model and a dynamic linear system to depict the relationship between the output force and temperature. In addition, a thermoelectric model has been developed based on the first law of thermodynamics, whose function is to depict the relationship between the temperature and excitation current. All fitness values in the model validation of the compound model are larger than 87.949%. Hence, the compound model has a good generalization performance.

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来源期刊
Journal of Electronic Materials
Journal of Electronic Materials 工程技术-材料科学:综合
CiteScore
4.10
自引率
4.80%
发文量
693
审稿时长
3.8 months
期刊介绍: The Journal of Electronic Materials (JEM) reports monthly on the science and technology of electronic materials, while examining new applications for semiconductors, magnetic alloys, dielectrics, nanoscale materials, and photonic materials. The journal welcomes articles on methods for preparing and evaluating the chemical, physical, electronic, and optical properties of these materials. Specific areas of interest are materials for state-of-the-art transistors, nanotechnology, electronic packaging, detectors, emitters, metallization, superconductivity, and energy applications. Review papers on current topics enable individuals in the field of electronics to keep abreast of activities in areas peripheral to their own. JEM also selects papers from conferences such as the Electronic Materials Conference, the U.S. Workshop on the Physics and Chemistry of II-VI Materials, and the International Conference on Thermoelectrics. It benefits both specialists and non-specialists in the electronic materials field. A journal of The Minerals, Metals & Materials Society.
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