Hao Sun , Zhuangzhuang Hua , Hao Jiang , Dongying Dong , Guangyao Li , Junjia Cui
{"title":"电磁冲击下 Cu/TiB2 复合材料在压实过程中的致密化行为","authors":"Hao Sun , Zhuangzhuang Hua , Hao Jiang , Dongying Dong , Guangyao Li , Junjia Cui","doi":"10.1016/j.apt.2024.104653","DOIUrl":null,"url":null,"abstract":"<div><p>Cu/TiB<sub>2</sub> composite combines electrical conductivity and wear resistance, leading to its wide application prospect in electrical contact. In this study, electromagnetic impact was applied to compact Cu/TiB<sub>2</sub> powder. The interaction between powder and die under electromagnetic impact was analyzed by observing the surface quality, density, microstructure, and hardness. The results showed that when the energy was less than 21 kJ, the increase in energy could enhance density and tensile strength of the compact. However, when the energy exceeded 21 kJ, the state of compact hardly changed and burr near the edge would be worsened. Besides, the hardness of the upper surface increased gradually from the center to the edge, while the opposite was true for the lower surface, reflecting the spatial distribution of density. With the aid of simulation, it was found that the stress wave propagation influenced the densification behavior and led to the variation of density.</p></div>","PeriodicalId":7232,"journal":{"name":"Advanced Powder Technology","volume":"35 11","pages":"Article 104653"},"PeriodicalIF":4.2000,"publicationDate":"2024-09-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Densification behavior in compaction for Cu/TiB2 composite under electromagnetic impact\",\"authors\":\"Hao Sun , Zhuangzhuang Hua , Hao Jiang , Dongying Dong , Guangyao Li , Junjia Cui\",\"doi\":\"10.1016/j.apt.2024.104653\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>Cu/TiB<sub>2</sub> composite combines electrical conductivity and wear resistance, leading to its wide application prospect in electrical contact. In this study, electromagnetic impact was applied to compact Cu/TiB<sub>2</sub> powder. The interaction between powder and die under electromagnetic impact was analyzed by observing the surface quality, density, microstructure, and hardness. The results showed that when the energy was less than 21 kJ, the increase in energy could enhance density and tensile strength of the compact. However, when the energy exceeded 21 kJ, the state of compact hardly changed and burr near the edge would be worsened. Besides, the hardness of the upper surface increased gradually from the center to the edge, while the opposite was true for the lower surface, reflecting the spatial distribution of density. With the aid of simulation, it was found that the stress wave propagation influenced the densification behavior and led to the variation of density.</p></div>\",\"PeriodicalId\":7232,\"journal\":{\"name\":\"Advanced Powder Technology\",\"volume\":\"35 11\",\"pages\":\"Article 104653\"},\"PeriodicalIF\":4.2000,\"publicationDate\":\"2024-09-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Advanced Powder Technology\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0921883124003297\",\"RegionNum\":2,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, CHEMICAL\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Advanced Powder Technology","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0921883124003297","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, CHEMICAL","Score":null,"Total":0}
Densification behavior in compaction for Cu/TiB2 composite under electromagnetic impact
Cu/TiB2 composite combines electrical conductivity and wear resistance, leading to its wide application prospect in electrical contact. In this study, electromagnetic impact was applied to compact Cu/TiB2 powder. The interaction between powder and die under electromagnetic impact was analyzed by observing the surface quality, density, microstructure, and hardness. The results showed that when the energy was less than 21 kJ, the increase in energy could enhance density and tensile strength of the compact. However, when the energy exceeded 21 kJ, the state of compact hardly changed and burr near the edge would be worsened. Besides, the hardness of the upper surface increased gradually from the center to the edge, while the opposite was true for the lower surface, reflecting the spatial distribution of density. With the aid of simulation, it was found that the stress wave propagation influenced the densification behavior and led to the variation of density.
期刊介绍：
The aim of Advanced Powder Technology is to meet the demand for an international journal that integrates all aspects of science and technology research on powder and particulate materials. The journal fulfills this purpose by publishing original research papers, rapid communications, reviews, and translated articles by prominent researchers worldwide.
The editorial work of Advanced Powder Technology, which was founded as the International Journal of the Society of Powder Technology, Japan, is now shared by distinguished board members, who operate in a unique framework designed to respond to the increasing global demand for articles on not only powder and particles, but also on various materials produced from them.
Advanced Powder Technology covers various areas, but a discussion of powder and particles is required in articles. Topics include: Production of powder and particulate materials in gases and liquids(nanoparticles, fine ceramics, pharmaceuticals, novel functional materials, etc.); Aerosol and colloidal processing; Powder and particle characterization; Dynamics and phenomena; Calculation and simulation (CFD, DEM, Monte Carlo method, population balance, etc.); Measurement and control of powder processes; Particle modification; Comminution; Powder handling and operations (storage, transport, granulation, separation, fluidization, etc.)
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