利用激光热成像测试识别裂纹的快速部署模型

IF 3.1 3区 物理与天体物理 Q2 INSTRUMENTS & INSTRUMENTATION
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引用次数: 0

摘要

本文介绍了一种新颖的特征提取方法,可高效地训练和部署神经网络,用于快速识别激光阵列点热成像技术(LAST)中的裂纹缺陷。我们基于像素级特征训练了裂纹缺陷识别模型,使用 Frangi 滤波器将每个像素编码为特征向量,并使用神经网络对其进行分类。实验结果表明,Frangi 特征是区分实验中裂纹、斑点和背景噪声干扰的有效方法。此外,该模型只需要一个较小的感兴趣区域(ROI)作为训练样本,就能在相同的检测条件下实现有效的训练和高效的裂纹识别,从而可以在实际检测中快速部署。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A fast deployable model for crack identification with laser thermography testing

This paper presents a novel feature extraction method, enabling efficient training and deployment of neural networks for rapid identification of crack defects in Laser Array Spot Thermography (LAST). We trained the crack defect identification model based on pixel-level features, encoding each pixel as a feature vector using Frangi filter, and classifying them using a neural network. Experimental results demonstrate that Frangi features are an effective method for distinguishing cracks, speckles, and background noise interference in the experiment. Furthermore, the model only requires a small region of interest (ROI) as training samples to achieve effective training and efficient crack identification under the same detection conditions, allowing for rapid deployment in practical inspections.

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来源期刊
CiteScore
5.70
自引率
12.10%
发文量
400
审稿时长
67 days
期刊介绍: The Journal covers the entire field of infrared physics and technology: theory, experiment, application, devices and instrumentation. Infrared'' is defined as covering the near, mid and far infrared (terahertz) regions from 0.75um (750nm) to 1mm (300GHz.) Submissions in the 300GHz to 100GHz region may be accepted at the editors discretion if their content is relevant to shorter wavelengths. Submissions must be primarily concerned with and directly relevant to this spectral region. Its core topics can be summarized as the generation, propagation and detection, of infrared radiation; the associated optics, materials and devices; and its use in all fields of science, industry, engineering and medicine. Infrared techniques occur in many different fields, notably spectroscopy and interferometry; material characterization and processing; atmospheric physics, astronomy and space research. Scientific aspects include lasers, quantum optics, quantum electronics, image processing and semiconductor physics. Some important applications are medical diagnostics and treatment, industrial inspection and environmental monitoring.
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