{"title":"带背面辅助槽的新型直槽横向磁触点之间的真空电弧特性研究","authors":"","doi":"10.1016/j.vacuum.2024.113620","DOIUrl":null,"url":null,"abstract":"<div><p>The motion stability of the vacuum arc between TMF contacts significantly affects the breaking capacity of vacuum switches. The vacuum arc movement can be effectively controlled by slots on the TMF contacts to provide the necessary driving force. However, the necessary cross-slot movement of the arc affects its stability. In this paper, a novel straight-slot transverse magnetic field (SSTMF) contact structure with additional auxiliary slots on the back is proposed to improve current distribution and avoid stagnation at the contact center. The simulation analysis was conducted on the force acting on the arc at different positions and the magnetic field distribution between the contacts. Additionally, the arcing experiments were performed in a demountable vacuum chamber for both novel and traditional SSTMF contacts. The SEM analyses were carried out for the contacts after the experiments. Combined with simulation and comparative experimental results, it is verified that the auxiliary slots can improve the control and driving effect on the arc. This can provide ideas and references for future contact design and improve the breaking performance of vacuum circuit breakers.</p></div>","PeriodicalId":23559,"journal":{"name":"Vacuum","volume":null,"pages":null},"PeriodicalIF":3.8000,"publicationDate":"2024-09-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Study on the vacuum arc characteristics between novel straight slot transverse magnetic contacts with auxiliary slots on the back\",\"authors\":\"\",\"doi\":\"10.1016/j.vacuum.2024.113620\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>The motion stability of the vacuum arc between TMF contacts significantly affects the breaking capacity of vacuum switches. The vacuum arc movement can be effectively controlled by slots on the TMF contacts to provide the necessary driving force. However, the necessary cross-slot movement of the arc affects its stability. In this paper, a novel straight-slot transverse magnetic field (SSTMF) contact structure with additional auxiliary slots on the back is proposed to improve current distribution and avoid stagnation at the contact center. The simulation analysis was conducted on the force acting on the arc at different positions and the magnetic field distribution between the contacts. Additionally, the arcing experiments were performed in a demountable vacuum chamber for both novel and traditional SSTMF contacts. The SEM analyses were carried out for the contacts after the experiments. Combined with simulation and comparative experimental results, it is verified that the auxiliary slots can improve the control and driving effect on the arc. This can provide ideas and references for future contact design and improve the breaking performance of vacuum circuit breakers.</p></div>\",\"PeriodicalId\":23559,\"journal\":{\"name\":\"Vacuum\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":3.8000,\"publicationDate\":\"2024-09-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Vacuum\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0042207X24006663\",\"RegionNum\":2,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"MATERIALS SCIENCE, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Vacuum","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0042207X24006663","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
Study on the vacuum arc characteristics between novel straight slot transverse magnetic contacts with auxiliary slots on the back
The motion stability of the vacuum arc between TMF contacts significantly affects the breaking capacity of vacuum switches. The vacuum arc movement can be effectively controlled by slots on the TMF contacts to provide the necessary driving force. However, the necessary cross-slot movement of the arc affects its stability. In this paper, a novel straight-slot transverse magnetic field (SSTMF) contact structure with additional auxiliary slots on the back is proposed to improve current distribution and avoid stagnation at the contact center. The simulation analysis was conducted on the force acting on the arc at different positions and the magnetic field distribution between the contacts. Additionally, the arcing experiments were performed in a demountable vacuum chamber for both novel and traditional SSTMF contacts. The SEM analyses were carried out for the contacts after the experiments. Combined with simulation and comparative experimental results, it is verified that the auxiliary slots can improve the control and driving effect on the arc. This can provide ideas and references for future contact design and improve the breaking performance of vacuum circuit breakers.
期刊介绍：
Vacuum is an international rapid publications journal with a focus on short communication. All papers are peer-reviewed, with the review process for short communication geared towards very fast turnaround times. The journal also published full research papers, thematic issues and selected papers from leading conferences.
A report in Vacuum should represent a major advance in an area that involves a controlled environment at pressures of one atmosphere or below.
The scope of the journal includes:
1. Vacuum; original developments in vacuum pumping and instrumentation, vacuum measurement, vacuum gas dynamics, gas-surface interactions, surface treatment for UHV applications and low outgassing, vacuum melting, sintering, and vacuum metrology. Technology and solutions for large-scale facilities (e.g., particle accelerators and fusion devices). New instrumentation ( e.g., detectors and electron microscopes).
2. Plasma science; advances in PVD, CVD, plasma-assisted CVD, ion sources, deposition processes and analysis.
3. Surface science; surface engineering, surface chemistry, surface analysis, crystal growth, ion-surface interactions and etching, nanometer-scale processing, surface modification.
4. Materials science; novel functional or structural materials. Metals, ceramics, and polymers. Experiments, simulations, and modelling for understanding structure-property relationships. Thin films and coatings. Nanostructures and ion implantation.
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