带凹槽多孔芯结构和多孔泡沫铜插件的平板微热管阵列传热特性的实验研究

IF 6.1 2区 工程技术 Q2 ENERGY & FUELS
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引用次数: 0

摘要

5G 技术和电子元件的高速发展为微型热管阵列(MHPA)提供了机遇。本研究提出了一种凹槽多孔灯芯结构热管(MHPA-CFW),该热管具有注入泡沫铜的 MHPA 微鳍结构,可提高热传导性能。研究探讨了 MHPA-CFW 的传热能力如何受到泡沫铜的孔密度和宽度的影响。研究还考察了其在不同工作倾角下对抗重力的能力。实验结果表明,MHPA-CFW 的传热能力优于 MHPA。在垂直工作状态下,随着孔隙密度的增加,低热流量下的传热能力也随之增加。然而,当热流量超过 3.75 W/cm2 时,随着孔隙密度的增加,传热能力最初会有所改善,但随后会减弱。传热能力随着泡沫铜宽度的增加而减弱。多方向实验选择了 4#MHPA-CFW(95PPI,1.0 毫米)。结果表明,当工作倾角从 90° 变为 -10° 时,它能克服重力的影响,从而大大提高传热能力。这些结果为改进热传导和扩大热管在电子散热中的应用提供了参考。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Experimental study on the heat transfer characteristics of flat-plate micro heat pipe arrays with grooved porous wick structure and porous copper foam inserts

The high-speed development of 5G technology and electronic components has provided an opportunity for micro heat pipe arrays (MHPAs). This study proposes a grooved multi-hole wick structure heat pipe (MHPA-CFW) with an MHPA micro-fin structure injected with copper foam to enhance the heat transfer performance. The study investigates how the heat transfer capability of MHPA-CFW is affected by the pore density and width of copper foam. It also examines its ability to function against gravity at various working inclinations. Experimental findings demonstrate that the MHPA-CFW exhibits superior heat transfer capability compared with that of MHPA. Under vertical operation, the heat transfer capability increases as the pore density rises at the low heat flux. However, it initially improves and then weakens with an increase in the pore density when the heat flux exceeds 3.75  W/cm2. The heat transfer capability deteriorates as the copper foam width increases. A 4#MHPA-CFW (95PPI, 1.0 mm) was chosen for the multi-orientation experiment. Results indicate that it significantly enhances the heat transfer capability by overcoming the effects of gravity when the working inclination angle changes from 90° to −10°. These results provide a reference for improving heat transfer and expanding heat pipe applications in electronic heat dissipation.

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来源期刊
Applied Thermal Engineering
Applied Thermal Engineering 工程技术-工程:机械
CiteScore
11.30
自引率
15.60%
发文量
1474
审稿时长
57 days
期刊介绍: Applied Thermal Engineering disseminates novel research related to the design, development and demonstration of components, devices, equipment, technologies and systems involving thermal processes for the production, storage, utilization and conservation of energy, with a focus on engineering application. The journal publishes high-quality and high-impact Original Research Articles, Review Articles, Short Communications and Letters to the Editor on cutting-edge innovations in research, and recent advances or issues of interest to the thermal engineering community.
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