{"title":"铜的连接:混合键合是拯救摩尔定律的 3D 芯片技术","authors":"Samuel K. Moore","doi":"10.1109/MSPEC.2024.10669241","DOIUrl":null,"url":null,"abstract":"Chipmakers continue to claw for every spare nano-meter to continue scaling down circuits, but a technology involving things that are much bigger—hundreds or thousands of nanometers across—could be just as significant over the next five years.","PeriodicalId":13249,"journal":{"name":"IEEE Spectrum","volume":null,"pages":null},"PeriodicalIF":2.6000,"publicationDate":"2024-09-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"The Copper Connection: Hybrid Bonding is the 3D-Chip Tech That's Saving Moore's Law\",\"authors\":\"Samuel K. Moore\",\"doi\":\"10.1109/MSPEC.2024.10669241\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Chipmakers continue to claw for every spare nano-meter to continue scaling down circuits, but a technology involving things that are much bigger—hundreds or thousands of nanometers across—could be just as significant over the next five years.\",\"PeriodicalId\":13249,\"journal\":{\"name\":\"IEEE Spectrum\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":2.6000,\"publicationDate\":\"2024-09-06\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Spectrum\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10669241/\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Spectrum","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10669241/","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
The Copper Connection: Hybrid Bonding is the 3D-Chip Tech That's Saving Moore's Law
Chipmakers continue to claw for every spare nano-meter to continue scaling down circuits, but a technology involving things that are much bigger—hundreds or thousands of nanometers across—could be just as significant over the next five years.
期刊介绍:
IEEE Spectrum Magazine, the flagship publication of the IEEE, explores the development, applications and implications of new technologies. It anticipates trends in engineering, science, and technology, and provides a forum for understanding, discussion and leadership in these areas.
IEEE Spectrum is the world''s leading engineering and scientific magazine. Read by over 300,000 engineers worldwide, Spectrum provides international coverage of all technical issues and advances in computers, communications, and electronics. Written in clear, concise language for the non-specialist, Spectrum''s high editorial standards and worldwide resources ensure technical accuracy and state-of-the-art relevance.