激光在硅中嵌入纳米级器件

IF 2.6 4区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Spectrum Pub Date : 2024-09-06 DOI:10.1109/MSPEC.2024.10669256

Edd Gent

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引用次数: 0

摘要

位于土耳其安卡拉的比尔肯特大学（Bilkent University）的一个工程师小组不是在硅晶片的顶部，而是在其表面下的一层制造出了一个纳米级光学元件。为了实现这一目标，他们使用了一种被称为贝塞尔光束的特殊激光，其光线可以穿过硅片表面并与下面的硅相互作用。由于贝塞尔光束的光线不会发生衍射，因此现在可以在硅片内部创建小至 100 纳米的二维结构。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Laser Embeds Nanoscale Device in Silicon

A team of engineers at Bilkent University, in Ankara, Türkiye, has built a nanoscale optical element not on top of a silicon wafer, but rather in a layer below the surface. To achieve this, they used a special type of laser known as a Bessel beam, whose light can pass through the surface of a wafer and interact with the silicon below. Because the Bessel beam's light doesn't diffract, it's now possible to create two-dimensional structures inside the silicon as small as 100 nanometers.

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来源期刊

IEEE Spectrum 工程技术-工程：电子与电气

CiteScore

2.50

自引率

0.00%

发文量

254

审稿时长

4-8 weeks

期刊介绍： IEEE Spectrum Magazine, the flagship publication of the IEEE, explores the development, applications and implications of new technologies. It anticipates trends in engineering, science, and technology, and provides a forum for understanding, discussion and leadership in these areas. IEEE Spectrum is the world''s leading engineering and scientific magazine. Read by over 300,000 engineers worldwide, Spectrum provides international coverage of all technical issues and advances in computers, communications, and electronics. Written in clear, concise language for the non-specialist, Spectrum''s high editorial standards and worldwide resources ensure technical accuracy and state-of-the-art relevance.