仅有三个时钟晶体管的高能效、单相、无争用触发器

IF 1.9 3区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Microelectronics Journal Pub Date : 2024-08-26 DOI:10.1016/j.mejo.2024.106390

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引用次数: 0

摘要

近年来，功率和/或能效设计推动了触发器的研究。触发器的功耗基于数据活动 (DA)，在许多应用中，DA 为 5%-15%。在这种情况下，大量的时钟功率和能量被浪费。本文提出了一种仅有三个单相时钟晶体管的高能效、无竞争触发器，它具有低功耗，并消除了电路中不必要的内部转换。这种触发器被称为 3CTSPC。测试芯片测量结果表明，在 VDD = 1 V、CK = 25 MHz 和 DA = 12.5% 的条件下，3CTSPC 比 18TSPC 和 TGFF 的能效分别高出 11% 和 58%。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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A power-efficient, single-phase, contention-free flip-flop with only three clock transistors

Flip-flop research in recent years has been motivated by power- and/or energy-efficient designs. Flip-flop power is based on data activity (DA), which in many applications ranges from 5 to 15%. In such cases, a substantial amount of clock power and energy is wasted. In this paper, a power-efficient, contention-free flip-flop with only three single-phase clock transistors is proposed, which has low-power consumption and eliminates unnecessary internal transitions in the circuit. This flip-flop is referred as 3CTSPC. Test-chip measurement results show that at VDD = 1 V, CK = 25 MHz, and DA = 12.5%, 3CTSPC is 11% and 58% more power-efficient than 18TSPC and TGFF, respectively.

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来源期刊

Microelectronics Journal 工程技术-工程：电子与电气

CiteScore

4.00

自引率

27.30%

发文量

222

审稿时长

43 days

期刊介绍： Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems. The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc. Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.