通过在接缝处设置台阶以及区分初始和最终脱粘应力,提高粘合强度

IF 7.6 2区 材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY
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However, in step joints, the final failure stress <span><math><mrow><msubsup><mi>σ</mi><mrow><mi>c</mi></mrow><mrow><mi>Final</mi></mrow></msubsup></mrow></math></span> can be greater than the initial delamination stress <span><math><mrow><msubsup><mi>σ</mi><mrow><mi>c</mi></mrow><mrow><mi>Initial</mi></mrow></msubsup></mrow></math></span> &lt; <span><math><mrow><msubsup><mi>σ</mi><mrow><mi>c</mi></mrow><mrow><mi>Final</mi></mrow></msubsup></mrow></math></span>. To clarify the adhesive improvement mechanism, first, this paper discusses the ISSF (Intensity of Singular Stress Fields) for fully bonded step joint by varying the number of steps <span><math><mrow><msub><mi>N</mi><mi>S</mi></msub></mrow></math></span>. Second, the singular stress field causing 2nd debonding is discussed by analyzing partially delaminated step joint. 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引用次数: 0

摘要

阶梯粘接接头具有与其他接头截然不同的特性。当其他接头(如对接接头、搭接接头和疤痕接头)出现初始分层时,总会出现最终失效。在这些情况下,导致初始分层的外部应力 σcInitial 等于最终破坏应力 σcFinal = σcInitial。然而,在阶梯接头中,最终破坏应力 σcFinal 可能大于初始分层应力 σcInitial < σcFinal。为了阐明粘合力改善机制,本文首先讨论了通过改变阶数 NS 实现全粘合阶梯接头的 ISSF(奇异应力场强度)。其次,通过分析部分分层的阶梯接头,讨论了导致第二次脱粘的奇异应力场。结果表明,第 2 次脱胶所需的外部载荷大于初始脱胶时的σcInitial < σcFinal。这是因为在相同的外部载荷下,导致第二次脱粘的奇异应力小于导致初次脱粘的奇异应力。当 NS≥6 和合适的重叠长度时,最终粘接强度 σcFinal 可以比初始分层应力 σcInitial ≪σcFinal 大 3.6 ∼ 4.4 倍,从而获得更大的粘接强度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Adhesive strength improvement by providing steps in joints and differentiating initial and final debonding stresses

Adhesive strength improvement by providing steps in joints and differentiating initial and final debonding stresses

Step adhesive joints have a special characteristic quite different from other joints. When initial delamination occurs in other joints such as butt, lap and scarf joints, final failure always occurs. In these cases, the external stress causing initial delamination σcInitial is equal to the final failure stress as σcFinal = σcInitial. However, in step joints, the final failure stress σcFinal can be greater than the initial delamination stress σcInitial < σcFinal. To clarify the adhesive improvement mechanism, first, this paper discusses the ISSF (Intensity of Singular Stress Fields) for fully bonded step joint by varying the number of steps NS. Second, the singular stress field causing 2nd debonding is discussed by analyzing partially delaminated step joint. The results show that 2nd debonding requires larger external load than the initial debonding as σcInitial < σcFinal. This is because under the same external load the singular stress causing the 2nd deboning is smaller than the one causing the initial debonding. When NS6 and suitable overlap length, the final bond strength σcFinal can be more than 3.6 ∼ 4.4 times larger than the initial delamination stress σcInitial σcFinal resulting in much larger bond strength.

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来源期刊
Materials & Design
Materials & Design Engineering-Mechanical Engineering
CiteScore
14.30
自引率
7.10%
发文量
1028
审稿时长
85 days
期刊介绍: Materials and Design is a multi-disciplinary journal that publishes original research reports, review articles, and express communications. The journal focuses on studying the structure and properties of inorganic and organic materials, advancements in synthesis, processing, characterization, and testing, the design of materials and engineering systems, and their applications in technology. It aims to bring together various aspects of materials science, engineering, physics, and chemistry. The journal explores themes ranging from materials to design and aims to reveal the connections between natural and artificial materials, as well as experiment and modeling. Manuscripts submitted to Materials and Design should contain elements of discovery and surprise, as they often contribute new insights into the architecture and function of matter.
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