{"title":"通过有机胺催化合成提高硅晶片的浆料稳定性和表面平整度 Silica Sol.","authors":"Yi Xing, Weilei Wang, Weili Liu, Zhitang Song","doi":"10.3390/nano14161371","DOIUrl":null,"url":null,"abstract":"<p><p>The stability of slurries used for chemical mechanical polishing (CMP) is a crucial concern in industrial chip production, influencing both the quality and cost-effectiveness of polishing fluids. In silicon wafer polishing, the conventional use of commercial neutral silica sol combined with organic bases often leads to slurry instability. To address this issue, this study proposes organic amines-specifically ethanolamine (MEA), ethylenediamine (EDA), and tetramethylammonium hydroxide (TMAOH)-as catalysts for synthesizing alkaline silica sol tailored for silicon wafer polishing fluids. Sol-gel experiments and zeta potential measurements demonstrate the efficacy of this approach in enhancing the stability of silica sol. The quantitative analysis of surface hydroxyl groups reveals a direct correlation between enhanced stability and increased hydroxyl content. The application of the alkaline silica sol in silicon wafer polishing fluids improves polishing rates and enhances surface flatness according to atomic force microscopy (AFM). In addition, electrochemical experiments validate the capability of this polishing solution to mitigate corrosion on silicon wafer surfaces. These findings hold significant implications for the advancement of chemical mechanical polishing techniques in the field of integrated circuit fabrication.</p>","PeriodicalId":18966,"journal":{"name":"Nanomaterials","volume":null,"pages":null},"PeriodicalIF":4.4000,"publicationDate":"2024-08-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.ncbi.nlm.nih.gov/pmc/articles/PMC11357041/pdf/","citationCount":"0","resultStr":"{\"title\":\"Enhancing Slurry Stability and Surface Flatness of Silicon Wafers through Organic Amine-Catalyzed Synthesis Silica Sol.\",\"authors\":\"Yi Xing, Weilei Wang, Weili Liu, Zhitang Song\",\"doi\":\"10.3390/nano14161371\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<p><p>The stability of slurries used for chemical mechanical polishing (CMP) is a crucial concern in industrial chip production, influencing both the quality and cost-effectiveness of polishing fluids. In silicon wafer polishing, the conventional use of commercial neutral silica sol combined with organic bases often leads to slurry instability. To address this issue, this study proposes organic amines-specifically ethanolamine (MEA), ethylenediamine (EDA), and tetramethylammonium hydroxide (TMAOH)-as catalysts for synthesizing alkaline silica sol tailored for silicon wafer polishing fluids. Sol-gel experiments and zeta potential measurements demonstrate the efficacy of this approach in enhancing the stability of silica sol. The quantitative analysis of surface hydroxyl groups reveals a direct correlation between enhanced stability and increased hydroxyl content. The application of the alkaline silica sol in silicon wafer polishing fluids improves polishing rates and enhances surface flatness according to atomic force microscopy (AFM). In addition, electrochemical experiments validate the capability of this polishing solution to mitigate corrosion on silicon wafer surfaces. These findings hold significant implications for the advancement of chemical mechanical polishing techniques in the field of integrated circuit fabrication.</p>\",\"PeriodicalId\":18966,\"journal\":{\"name\":\"Nanomaterials\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":4.4000,\"publicationDate\":\"2024-08-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://www.ncbi.nlm.nih.gov/pmc/articles/PMC11357041/pdf/\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Nanomaterials\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://doi.org/10.3390/nano14161371\",\"RegionNum\":3,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"CHEMISTRY, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Nanomaterials","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.3390/nano14161371","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"CHEMISTRY, MULTIDISCIPLINARY","Score":null,"Total":0}
Enhancing Slurry Stability and Surface Flatness of Silicon Wafers through Organic Amine-Catalyzed Synthesis Silica Sol.
The stability of slurries used for chemical mechanical polishing (CMP) is a crucial concern in industrial chip production, influencing both the quality and cost-effectiveness of polishing fluids. In silicon wafer polishing, the conventional use of commercial neutral silica sol combined with organic bases often leads to slurry instability. To address this issue, this study proposes organic amines-specifically ethanolamine (MEA), ethylenediamine (EDA), and tetramethylammonium hydroxide (TMAOH)-as catalysts for synthesizing alkaline silica sol tailored for silicon wafer polishing fluids. Sol-gel experiments and zeta potential measurements demonstrate the efficacy of this approach in enhancing the stability of silica sol. The quantitative analysis of surface hydroxyl groups reveals a direct correlation between enhanced stability and increased hydroxyl content. The application of the alkaline silica sol in silicon wafer polishing fluids improves polishing rates and enhances surface flatness according to atomic force microscopy (AFM). In addition, electrochemical experiments validate the capability of this polishing solution to mitigate corrosion on silicon wafer surfaces. These findings hold significant implications for the advancement of chemical mechanical polishing techniques in the field of integrated circuit fabrication.
期刊介绍:
Nanomaterials (ISSN 2076-4991) is an international and interdisciplinary scholarly open access journal. It publishes reviews, regular research papers, communications, and short notes that are relevant to any field of study that involves nanomaterials, with respect to their science and application. Thus, theoretical and experimental articles will be accepted, along with articles that deal with the synthesis and use of nanomaterials. Articles that synthesize information from multiple fields, and which place discoveries within a broader context, will be preferred. There is no restriction on the length of the papers. Our aim is to encourage scientists to publish their experimental and theoretical research in as much detail as possible. Full experimental or methodical details, or both, must be provided for research articles. Computed data or files regarding the full details of the experimental procedure, if unable to be published in a normal way, can be deposited as supplementary material. Nanomaterials is dedicated to a high scientific standard. All manuscripts undergo a rigorous reviewing process and decisions are based on the recommendations of independent reviewers.