Yuxuan Huang , Zhihua Tao , Xudong Cai , Zhiyuan Long , Zewei Lin , Wenlei Li , Zhen Fang , Lingyue Wang , Siqi He , Xingzhou Cai , Yong Li , Jihua Zhang
{"title":"作为粘合剂和导电层的非电解镀银通孔玻璃 (TGV)","authors":"Yuxuan Huang , Zhihua Tao , Xudong Cai , Zhiyuan Long , Zewei Lin , Wenlei Li , Zhen Fang , Lingyue Wang , Siqi He , Xingzhou Cai , Yong Li , Jihua Zhang","doi":"10.1016/j.mejo.2024.106371","DOIUrl":null,"url":null,"abstract":"<div><p>The proposed method presents a scheme to modify the surface of the glass substrate using the piranha solution and to fabricate the conducting layer of the Through-glass Via (TGV) by the glucose-Ag electroless plating to achieve TGV metallization. The arithmetic mean deviation of the surface contours (Ra) for the substrates increases from 0.001 to 0.135. The contact angle of the substrates (unmodified and modified) is reduced to 6.4° and 12.2°, respectively. The sensitization process with SnCl<sub>2</sub> and the activation process with silver ammonia solution are conducted using the glucose as the reducing agent to prepare the silver seed layer covered in the TGV through-vias with a high aspect ratio (9:1). The adhesion between the metal coating and the surface is measured by the 3M tape and chemical mechanical polishing (CMP). The metal coating adheres well to the surface-modified substrate without peeling off, which can satisfy the demands for the electroplating and CMP processes.</p></div>","PeriodicalId":49818,"journal":{"name":"Microelectronics Journal","volume":null,"pages":null},"PeriodicalIF":1.9000,"publicationDate":"2024-08-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Electroless silver plating on through-glass via (TGV) as an adhesive and conducting layer\",\"authors\":\"Yuxuan Huang , Zhihua Tao , Xudong Cai , Zhiyuan Long , Zewei Lin , Wenlei Li , Zhen Fang , Lingyue Wang , Siqi He , Xingzhou Cai , Yong Li , Jihua Zhang\",\"doi\":\"10.1016/j.mejo.2024.106371\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>The proposed method presents a scheme to modify the surface of the glass substrate using the piranha solution and to fabricate the conducting layer of the Through-glass Via (TGV) by the glucose-Ag electroless plating to achieve TGV metallization. The arithmetic mean deviation of the surface contours (Ra) for the substrates increases from 0.001 to 0.135. The contact angle of the substrates (unmodified and modified) is reduced to 6.4° and 12.2°, respectively. The sensitization process with SnCl<sub>2</sub> and the activation process with silver ammonia solution are conducted using the glucose as the reducing agent to prepare the silver seed layer covered in the TGV through-vias with a high aspect ratio (9:1). The adhesion between the metal coating and the surface is measured by the 3M tape and chemical mechanical polishing (CMP). The metal coating adheres well to the surface-modified substrate without peeling off, which can satisfy the demands for the electroplating and CMP processes.</p></div>\",\"PeriodicalId\":49818,\"journal\":{\"name\":\"Microelectronics Journal\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":1.9000,\"publicationDate\":\"2024-08-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Microelectronics Journal\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S1879239124000754\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Journal","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1879239124000754","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Electroless silver plating on through-glass via (TGV) as an adhesive and conducting layer
The proposed method presents a scheme to modify the surface of the glass substrate using the piranha solution and to fabricate the conducting layer of the Through-glass Via (TGV) by the glucose-Ag electroless plating to achieve TGV metallization. The arithmetic mean deviation of the surface contours (Ra) for the substrates increases from 0.001 to 0.135. The contact angle of the substrates (unmodified and modified) is reduced to 6.4° and 12.2°, respectively. The sensitization process with SnCl2 and the activation process with silver ammonia solution are conducted using the glucose as the reducing agent to prepare the silver seed layer covered in the TGV through-vias with a high aspect ratio (9:1). The adhesion between the metal coating and the surface is measured by the 3M tape and chemical mechanical polishing (CMP). The metal coating adheres well to the surface-modified substrate without peeling off, which can satisfy the demands for the electroplating and CMP processes.
期刊介绍：
Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems.
The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc.
Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.
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