RIS 辅助混合多接入短分组系统的联合吞吐量和块长优化

IF 4.6 3区 计算机科学 Q1 COMPUTER SCIENCE, INFORMATION SYSTEMS
Hong Wang;Yibo Fu;Zheng Shi;Youhong Feng
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引用次数: 0

摘要

混合多址接入集成了非正交多址接入(NOMA)和正交多址接入(OMA),为接入各种类型的设备和大量设备提供了更大的灵活性。本文研究了一种可重构智能表面(RIS)辅助的混合 NOMA-OMA 短包(RAHNOSP)系统,在该系统中,NOMA 和 OMA 设备在 RIS 的辅助下向接入点传输信息。具体来说,我们的重点是优化 RAHNOSP 系统的吞吐量和块长度。为此,我们提出了一个多目标优化(MOO)问题,旨在同时实现吞吐量最大化和块长度最小化。为了使 MOO 问题具有可操作性,我们使用切比雪夫变换将 MOO 转换为单目标优化问题,然后将转换后的问题分解为两个子问题,并使用交替优化法解决它们。数值结果表明,所提出的混合 NOMA-OMA 方案在吞吐量-块长权衡方面优于现有策略。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Joint Throughput and Blocklength Optimization for RIS-Aided Hybrid Multi-Access Short-Packet System
Hybrid multi-access that integrates non-orthogonal multiple access (NOMA) and orthogonal multiple access (OMA), provides greater flexibility in accessing a diverse range of device types and a vast number of devices. This letter investigates a reconfigurable intelligent surface (RIS) aided hybrid NOMA-OMA short-packet (RAHNOSP) system, where NOMA and OMA devices transmit messages to the access point aided by an RIS. Specifically, we focus on optimizing the throughput and the blocklength in the RAHNOSP system. To this end, we formulate a multi-objective optimization (MOO) problem that aims to maximize throughput and minimize blocklength simultaneously. To make the MOO problem tractable, the Chebyshev transformation is invoked to convert the MOO into a single-objective optimization problem, and then we decompose the transformed problem into two subproblems and solve them by using alternating optimization. Numerical results demonstrate that the proposed hybrid NOMA-OMA scheme outperforms the existing strategies in terms of throughput-blocklength tradeoff.
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来源期刊
IEEE Wireless Communications Letters
IEEE Wireless Communications Letters Engineering-Electrical and Electronic Engineering
CiteScore
12.30
自引率
6.30%
发文量
481
期刊介绍: IEEE Wireless Communications Letters publishes short papers in a rapid publication cycle on advances in the state-of-the-art of wireless communications. Both theoretical contributions (including new techniques, concepts, and analyses) and practical contributions (including system experiments and prototypes, and new applications) are encouraged. This journal focuses on the physical layer and the link layer of wireless communication systems.
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