毫米波成像系统中用于迪克辐射计的非对称 CMOS 开关

IF 1.9 3区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Joon-Hyuk Yoon, Ha-Neul Lee, Ui-Gyu Choi, Jong-Ryul Yang
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引用次数: 0

摘要

本研究提出了一种采用块状互补金属氧化物半导体(CMOS)技术实现的非对称 Dicke 开关,以实现 D 波段的高隔离度和低插入损耗。Dicke 开关可消除天线传输信号中的噪声,从而在接收器前端提供高信噪比。所提出的 Dicke 开关在信号传输路径和参考噪声入射路径上采用了非对称结构,从而克服了插入损耗和隔离特性之间的权衡关系。拟议的非对称结构在参考元件中呈现出最佳阻抗,以实现与天线端口入射噪声相同的特性。Dicke 开关采用 65 纳米 RFCMOS 工艺制造,芯片尺寸为 350 × 490 μm2,包括所有焊盘。D 波段的测量结果显示,导通状态下的插入损耗低于 2.8 dB,关断状态下的隔离度高于 22 dB。在 155 GHz 和 122 GHz 时,分别测得最小插入损耗和最大隔离度为 1.7 dB 和 29 dB。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Asymmetric CMOS switch for Dicke radiometer in millimeter-wave imaging system

An asymmetric Dicke switch implemented in bulk complementary metal-oxide-semiconductor (CMOS) technology is proposed to achieve high isolation and low insertion loss in the D-band. A Dicke switch eliminates the noise in the signal transmitted from the antenna, providing a high signal-to-noise ratio at the receiver front end. The proposed Dicke switch employs an asymmetric configuration for the signal transmission path and the reference noise incidence path, which overcomes the trade-off relationship between the insertion loss and isolation characteristics. The proposed asymmetric structure presents an optimum impedance in the reference component to achieve the same characteristics as those of the noise incident from the antenna port. The Dicke switch is fabricated using the 65-nm RFCMOS process with a chip size of 350 × 490 μm2, including all the pads. The measurement results in the D-band present an insertion loss below 2.8 dB in the on-state and isolation above 22 dB in the off-state. The minimum insertion loss and maximum isolation were measured to be 1.7 dB at 155 GHz and 29 dB at 122 GHz, respectively.

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来源期刊
Microelectronics Journal
Microelectronics Journal 工程技术-工程:电子与电气
CiteScore
4.00
自引率
27.30%
发文量
222
审稿时长
43 days
期刊介绍: Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems. The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc. Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.
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