Tianming Ni , Kejie Xu , Hao Wu , Senling Wang , Mu Nie
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A demultiplexer-based dual-path switching true random number generator
This paper presents a demultiplexer (DEMUX) based dual-path switching true random number generator (TRNG). Unlike the classical single chain TRNG, the proposed TRNG utilizes DEMUXs to separate the cumulative jitter and occurrence of metastability in two paths. It also uses Ring Oscillator (RO) to increase the uncertainty of path switching time. Therefore, two sources of entropy are skilfully combined and no post-processing circuitry is required. The proposed structure is implemented on Xilinx Virtex-7 FPGA development board. The experimental results show that the proposed structure is able to achieve a high throughput of 500 Mbps with 33 Look-up Tables (LUTs) and 4 Flip-Flops (FFs). This effectively improves the throughput with high quality entropy and low hardware overhead.
期刊介绍：
Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems.
The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc.
Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.
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