{"title":"基于耐高温聚合物的三维打印电磁扫描微镜","authors":"Yongseung Lee;Yong-Kweon Kim;Chang-Hyeon Ji","doi":"10.1109/LSENS.2024.3434616","DOIUrl":null,"url":null,"abstract":"In this letter, we present an electromagnetic scanning micromirror fabricated using 3-D printing with a high-temperature-resistant polymer. The micromirror comprises a 1-D scanning mechanism featuring a large gold-coated silicon mirror, supported by a 3-D-printed structural layer consisting of a mirror holder, gimbal, and two sets of torsion springs. The design incorpora- tes a series-connected dual spring–mass–damper system to enhance the optical scan angle at resonance. Actuation is achieved via Lorentz force applied to a self-supported coil inserted into the gimbal. The reflective surface has roun- ded edges and an outer dimension of 4.2 × 15 mm\n<sup>2</sup>\n. Permanent magnets are assembled with an aluminum jig on either side of the mirror holder, with a minimal gap of 0.55 mm. The device is fabri- cated using three different 3-D printing methods (digital light processing (DLP), fused deposition modeling, and stereolithography) and four different materials and subsequently tested. Among the fabricated devices, the one printed via DLP 3-D printing achieved a maximum optical scan angle of 20° at 1248 Hz, with an input current of 110 mA\n<sub>rms</sub>\n. Various characteristics of the 3-D-printed and assembled devices, including dimensional accuracy, surface topography, temperature effects, and driving characteristics, were analyzed. The fabricated micromirror can be integrated into a 2-D scanning module for light detection and ranging systems.","PeriodicalId":13014,"journal":{"name":"IEEE Sensors Letters","volume":null,"pages":null},"PeriodicalIF":2.2000,"publicationDate":"2024-07-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"High-Temperature-Resistant Polymer-Based 3-D-Printed Electromagnetic Scanning Micromirror\",\"authors\":\"Yongseung Lee;Yong-Kweon Kim;Chang-Hyeon Ji\",\"doi\":\"10.1109/LSENS.2024.3434616\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this letter, we present an electromagnetic scanning micromirror fabricated using 3-D printing with a high-temperature-resistant polymer. The micromirror comprises a 1-D scanning mechanism featuring a large gold-coated silicon mirror, supported by a 3-D-printed structural layer consisting of a mirror holder, gimbal, and two sets of torsion springs. The design incorpora- tes a series-connected dual spring–mass–damper system to enhance the optical scan angle at resonance. Actuation is achieved via Lorentz force applied to a self-supported coil inserted into the gimbal. The reflective surface has roun- ded edges and an outer dimension of 4.2 × 15 mm\\n<sup>2</sup>\\n. Permanent magnets are assembled with an aluminum jig on either side of the mirror holder, with a minimal gap of 0.55 mm. The device is fabri- cated using three different 3-D printing methods (digital light processing (DLP), fused deposition modeling, and stereolithography) and four different materials and subsequently tested. Among the fabricated devices, the one printed via DLP 3-D printing achieved a maximum optical scan angle of 20° at 1248 Hz, with an input current of 110 mA\\n<sub>rms</sub>\\n. Various characteristics of the 3-D-printed and assembled devices, including dimensional accuracy, surface topography, temperature effects, and driving characteristics, were analyzed. The fabricated micromirror can be integrated into a 2-D scanning module for light detection and ranging systems.\",\"PeriodicalId\":13014,\"journal\":{\"name\":\"IEEE Sensors Letters\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":2.2000,\"publicationDate\":\"2024-07-29\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Sensors Letters\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10613417/\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Sensors Letters","FirstCategoryId":"1085","ListUrlMain":"https://ieeexplore.ieee.org/document/10613417/","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
In this letter, we present an electromagnetic scanning micromirror fabricated using 3-D printing with a high-temperature-resistant polymer. The micromirror comprises a 1-D scanning mechanism featuring a large gold-coated silicon mirror, supported by a 3-D-printed structural layer consisting of a mirror holder, gimbal, and two sets of torsion springs. The design incorpora- tes a series-connected dual spring–mass–damper system to enhance the optical scan angle at resonance. Actuation is achieved via Lorentz force applied to a self-supported coil inserted into the gimbal. The reflective surface has roun- ded edges and an outer dimension of 4.2 × 15 mm
2
. Permanent magnets are assembled with an aluminum jig on either side of the mirror holder, with a minimal gap of 0.55 mm. The device is fabri- cated using three different 3-D printing methods (digital light processing (DLP), fused deposition modeling, and stereolithography) and four different materials and subsequently tested. Among the fabricated devices, the one printed via DLP 3-D printing achieved a maximum optical scan angle of 20° at 1248 Hz, with an input current of 110 mA
rms
. Various characteristics of the 3-D-printed and assembled devices, including dimensional accuracy, surface topography, temperature effects, and driving characteristics, were analyzed. The fabricated micromirror can be integrated into a 2-D scanning module for light detection and ranging systems.