低温基底上金纳米粒子墨水的一步式等离子喷射沉积和自烧结技术

Jacob Manzi;Tony Varghese;Josh Eixenberger;Lakshmi Prakasan;David Estrada;Harish Subbaraman
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引用次数: 0

摘要

纸张等低温基底上的柔性电子器件在一次性和生物兼容电子应用以及医疗保健、可穿戴设备和消费电子等领域的应用非常有吸引力。等离子喷射打印(PJP)使用介质阻挡放电等离子体将气溶胶纳米粒子聚焦到目标基底上。相同的等离子体可用于改变打印材料的特性,甚至可在原位烧结。在这项工作中,我们展示了如何在柔性低温基底上一步沉积金结构,而无需热处理或光子后处理。我们还探索了等离子体对金纳米粒子墨水沉积的影响。我们对等离子体电压进行了优化,以实现金纳米粒子的烧结,并介绍了一种制造具有更高附着力和导电性的迹线的简单程序,其峰值导电性为 6.2 次方 10^{5}$ S/m。在柔性基底上开发了 PJP 印刷金 LED 互连和微加热器,以证明这种在低温基底上单步烧结沉积导电迹线的潜力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
One-Step Plasma Jet Deposition and Self-Sintering of Gold Nanoparticle Inks on Low-Temperature Substrates
Flexible electronics on low-temperature substrates like paper are very appealing for their use in disposable and biocompatible electronic applications and areas like healthcare, wearables, and consumer electronics. Plasma-jet printing (PJP) uses a dielectric barrier discharge plasma to focus aerosolized nanoparticles onto a target substrate. The same plasma can be used to change the properties of the printed material and even sinter in situ. In this work, we demonstrate the one-step deposition of gold structures onto flexible and low-temperature substrates without the need for thermal or photonic postprocessing. We also explore the plasma effect on the deposition of the gold nanoparticle ink. The plasma voltage is optimized for the sintering of the gold nanoparticles, and a simple procedure for manufacturing traces with increased adhesion and conductivity is presented, with a peak conductivity of $6.2\times 10^{5}$ S/m. PJP-printed gold LED interconnects and microheaters on flexible substrates are developed to demonstrate the potential of this single-step sintered deposition of conductive traces on low-temperature substrates.
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