Influence of annealing treatment on performance of 4H–SiC SBD irradiated by heavy ions under room temperature and low temperature

The influence of the annealing treatment on the performance of commercial 4H–SiC Schottky barrier diodes (SBDs) subjected to heavy ion irradiation under room temperature (RT) and low temperature (LT) are presented. Experimental results confirm that annealing treatment effectively eliminates defects and interface states caused by heavy ion irradiation, particularly for 4H–SiC SBD under LT irradiation. Increasing the annealing temperature leads to the slight improvement in forward current, leakage current and breakdown voltage. However, the annealing process may result in the formation of Ti and Si compounds at the interface between the Schottky metal and SiC, as well as a significant number of vacancies. Combined with Technology Computer Aided Design (TCAD) simulations, it is concluded that the interface trap charge concentrations exceeding 1 × 10¹² cm⁻² significantly impact the breakdown characteristics of 4H–SiC SBDs.