{"title":"具有复杂微通道图案的 3D 打印散热器中的热效应和流体力学效应的协同作用","authors":"Win-Jet Luo, Pramod Vishwakarma, Bivas Panigrahi","doi":"10.1007/s10404-024-02751-x","DOIUrl":null,"url":null,"abstract":"<div><p>A compelling solution to the issue of high heat flux generated by flexible electronic devices has been found in liquid-based microfluidic cooling devices. It has been earlier realized that the varying microchannel hydrodynamics influences the overall heat transfer in these devices. However, microfluidic cooling devices that incorporate intricate microchannels have not been explored to their full potential. In this study, we investigate the use of 3-D intricate microchannel geometries in microfluidic heat sinks, their generated hydrodynamics, and their profound impact on the overall heat transfer process. Utilizing 3D-printed scaffold removal technology, three distinct microfluidic devices were fabricated, each distinguishable by its cross-sectional shape of the microchannel designs (coil, square, and triangle). These microfluidic devices, based on Polydimethylsiloxane-Graphene oxide (PDMS-GO) as substrate material, have been examined experimentally and numerically for their heat dissipation capacities under constant temperature heat source of 358 K at flow rates ranging from 40 to 400 μL/min. Experimental observation illustrates that the coil-microchannel configuration exhibited superior heat dissipation capabilities, outperforming both the square and triangle microchannels across all flow settings. Furthermore, numerical simulations corroborated this experimental finding by providing insights into through-plane temperature distribution, heat transfer coefficient, pressure drop, and channel hydrodynamics. Our study intends to advance the understanding of microchannel cooling, as well as emphasizes the importance of geometrical configuration towards optimal electronic hotspot cooling.</p></div>","PeriodicalId":706,"journal":{"name":"Microfluidics and Nanofluidics","volume":null,"pages":null},"PeriodicalIF":2.3000,"publicationDate":"2024-08-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Synergistic thermal and hydrodynamic effects in 3D-printed heat sinks with intricate microchannel patterns\",\"authors\":\"Win-Jet Luo, Pramod Vishwakarma, Bivas Panigrahi\",\"doi\":\"10.1007/s10404-024-02751-x\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>A compelling solution to the issue of high heat flux generated by flexible electronic devices has been found in liquid-based microfluidic cooling devices. It has been earlier realized that the varying microchannel hydrodynamics influences the overall heat transfer in these devices. However, microfluidic cooling devices that incorporate intricate microchannels have not been explored to their full potential. In this study, we investigate the use of 3-D intricate microchannel geometries in microfluidic heat sinks, their generated hydrodynamics, and their profound impact on the overall heat transfer process. Utilizing 3D-printed scaffold removal technology, three distinct microfluidic devices were fabricated, each distinguishable by its cross-sectional shape of the microchannel designs (coil, square, and triangle). These microfluidic devices, based on Polydimethylsiloxane-Graphene oxide (PDMS-GO) as substrate material, have been examined experimentally and numerically for their heat dissipation capacities under constant temperature heat source of 358 K at flow rates ranging from 40 to 400 μL/min. Experimental observation illustrates that the coil-microchannel configuration exhibited superior heat dissipation capabilities, outperforming both the square and triangle microchannels across all flow settings. Furthermore, numerical simulations corroborated this experimental finding by providing insights into through-plane temperature distribution, heat transfer coefficient, pressure drop, and channel hydrodynamics. Our study intends to advance the understanding of microchannel cooling, as well as emphasizes the importance of geometrical configuration towards optimal electronic hotspot cooling.</p></div>\",\"PeriodicalId\":706,\"journal\":{\"name\":\"Microfluidics and Nanofluidics\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":2.3000,\"publicationDate\":\"2024-08-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Microfluidics and Nanofluidics\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://link.springer.com/article/10.1007/s10404-024-02751-x\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"INSTRUMENTS & INSTRUMENTATION\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microfluidics and Nanofluidics","FirstCategoryId":"5","ListUrlMain":"https://link.springer.com/article/10.1007/s10404-024-02751-x","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"INSTRUMENTS & INSTRUMENTATION","Score":null,"Total":0}
引用次数: 0
摘要
对于柔性电子设备产生的高热通量问题,液基微流体冷却设备是一个令人信服的解决方案。人们较早意识到,不同的微通道流体力学会影响这些设备的整体热传递。然而,包含复杂微通道的微流体冷却设备尚未被充分挖掘其潜力。在本研究中,我们研究了微流体散热器中三维复杂微通道几何形状的使用、其产生的流体力学以及它们对整个传热过程的深远影响。利用三维打印支架移除技术,我们制造出了三种不同的微流体装置,每种装置都可通过微通道设计的横截面形状(线圈、方形和三角形)加以区分。这些微流控装置以聚二甲基硅氧烷-氧化石墨烯(PDMS-GO)为基底材料,在 358 K 的恒温热源条件下,以 40 至 400 μL/min 的流速对其散热能力进行了实验和数值检验。实验观察结果表明,线圈微通道配置的散热能力更强,在所有流量设置下均优于方形和三角形微通道。此外,数值模拟也证实了这一实验结果,并提供了对通面温度分布、传热系数、压降和通道流体力学的深入了解。我们的研究旨在推进对微通道冷却的理解,并强调几何配置对优化电子热点冷却的重要性。
Synergistic thermal and hydrodynamic effects in 3D-printed heat sinks with intricate microchannel patterns
A compelling solution to the issue of high heat flux generated by flexible electronic devices has been found in liquid-based microfluidic cooling devices. It has been earlier realized that the varying microchannel hydrodynamics influences the overall heat transfer in these devices. However, microfluidic cooling devices that incorporate intricate microchannels have not been explored to their full potential. In this study, we investigate the use of 3-D intricate microchannel geometries in microfluidic heat sinks, their generated hydrodynamics, and their profound impact on the overall heat transfer process. Utilizing 3D-printed scaffold removal technology, three distinct microfluidic devices were fabricated, each distinguishable by its cross-sectional shape of the microchannel designs (coil, square, and triangle). These microfluidic devices, based on Polydimethylsiloxane-Graphene oxide (PDMS-GO) as substrate material, have been examined experimentally and numerically for their heat dissipation capacities under constant temperature heat source of 358 K at flow rates ranging from 40 to 400 μL/min. Experimental observation illustrates that the coil-microchannel configuration exhibited superior heat dissipation capabilities, outperforming both the square and triangle microchannels across all flow settings. Furthermore, numerical simulations corroborated this experimental finding by providing insights into through-plane temperature distribution, heat transfer coefficient, pressure drop, and channel hydrodynamics. Our study intends to advance the understanding of microchannel cooling, as well as emphasizes the importance of geometrical configuration towards optimal electronic hotspot cooling.
期刊介绍:
Microfluidics and Nanofluidics is an international peer-reviewed journal that aims to publish papers in all aspects of microfluidics, nanofluidics and lab-on-a-chip science and technology. The objectives of the journal are to (1) provide an overview of the current state of the research and development in microfluidics, nanofluidics and lab-on-a-chip devices, (2) improve the fundamental understanding of microfluidic and nanofluidic phenomena, and (3) discuss applications of microfluidics, nanofluidics and lab-on-a-chip devices. Topics covered in this journal include:
1.000 Fundamental principles of micro- and nanoscale phenomena like,
flow, mass transport and reactions
3.000 Theoretical models and numerical simulation with experimental and/or analytical proof
4.000 Novel measurement & characterization technologies
5.000 Devices (actuators and sensors)
6.000 New unit-operations for dedicated microfluidic platforms
7.000 Lab-on-a-Chip applications
8.000 Microfabrication technologies and materials
Please note, Microfluidics and Nanofluidics does not publish manuscripts studying pure microscale heat transfer since there are many journals that cover this field of research (Journal of Heat Transfer, Journal of Heat and Mass Transfer, Journal of Heat and Fluid Flow, etc.).