{"title":"混合比例对 Sn-52In/Sn-3.0Ag-0.5Cu 混合焊点微观结构和机械性能的影响","authors":"W. T. Zhao, J. Ren, M. L. Huang","doi":"10.1007/s11664-024-11350-z","DOIUrl":null,"url":null,"abstract":"<p>The microstructural evolution and mechanical properties of Sn-52In/Sn-3.0Ag-0.5Cu hybrid solder joints soldered at different reflow temperatures (150°C, 175°C, 200°C) were investigated. The mixed percentage of as-soldered hybrid solder joints increased with increasing reflow temperature. With increasing mixed percentage, finely dispersed Ag<sub>2</sub>In and Ag<sub>3</sub>Sn particles led to significant refinement of the size of β-Sn grains, and consequently, the combined effect of fine grain strengthening and second-phase dispersion strengthening improved the shear strength, ductility, and fracture energy of the hybrid solder joints. The fracture site of the hybrid solder joints shifted from the Cu<sub>6</sub>(Sn, In)<sub>5</sub> intermetallic compound (IMC)/solder interface to the mixed zone of the solder, and the fine β-Sn grains attenuated crack propagation, enabling more fracture energy to be absorbed before fracture. The hybrid solder joint with 100% mixed percentage exhibited the highest shear strength of 87.8 MPa, highest displacement of 251 μm, and highest fracture energy of 1.4 J.</p>","PeriodicalId":626,"journal":{"name":"Journal of Electronic Materials","volume":"79 1","pages":""},"PeriodicalIF":2.2000,"publicationDate":"2024-08-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Effects of Mixed Percentage on the Microstructure and Mechanical Properties of Sn-52In/Sn-3.0Ag-0.5Cu Hybrid Solder Joints\",\"authors\":\"W. T. Zhao, J. Ren, M. L. Huang\",\"doi\":\"10.1007/s11664-024-11350-z\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<p>The microstructural evolution and mechanical properties of Sn-52In/Sn-3.0Ag-0.5Cu hybrid solder joints soldered at different reflow temperatures (150°C, 175°C, 200°C) were investigated. The mixed percentage of as-soldered hybrid solder joints increased with increasing reflow temperature. With increasing mixed percentage, finely dispersed Ag<sub>2</sub>In and Ag<sub>3</sub>Sn particles led to significant refinement of the size of β-Sn grains, and consequently, the combined effect of fine grain strengthening and second-phase dispersion strengthening improved the shear strength, ductility, and fracture energy of the hybrid solder joints. The fracture site of the hybrid solder joints shifted from the Cu<sub>6</sub>(Sn, In)<sub>5</sub> intermetallic compound (IMC)/solder interface to the mixed zone of the solder, and the fine β-Sn grains attenuated crack propagation, enabling more fracture energy to be absorbed before fracture. The hybrid solder joint with 100% mixed percentage exhibited the highest shear strength of 87.8 MPa, highest displacement of 251 μm, and highest fracture energy of 1.4 J.</p>\",\"PeriodicalId\":626,\"journal\":{\"name\":\"Journal of Electronic Materials\",\"volume\":\"79 1\",\"pages\":\"\"},\"PeriodicalIF\":2.2000,\"publicationDate\":\"2024-08-06\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Electronic Materials\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.1007/s11664-024-11350-z\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Electronic Materials","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1007/s11664-024-11350-z","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Effects of Mixed Percentage on the Microstructure and Mechanical Properties of Sn-52In/Sn-3.0Ag-0.5Cu Hybrid Solder Joints
The microstructural evolution and mechanical properties of Sn-52In/Sn-3.0Ag-0.5Cu hybrid solder joints soldered at different reflow temperatures (150°C, 175°C, 200°C) were investigated. The mixed percentage of as-soldered hybrid solder joints increased with increasing reflow temperature. With increasing mixed percentage, finely dispersed Ag2In and Ag3Sn particles led to significant refinement of the size of β-Sn grains, and consequently, the combined effect of fine grain strengthening and second-phase dispersion strengthening improved the shear strength, ductility, and fracture energy of the hybrid solder joints. The fracture site of the hybrid solder joints shifted from the Cu6(Sn, In)5 intermetallic compound (IMC)/solder interface to the mixed zone of the solder, and the fine β-Sn grains attenuated crack propagation, enabling more fracture energy to be absorbed before fracture. The hybrid solder joint with 100% mixed percentage exhibited the highest shear strength of 87.8 MPa, highest displacement of 251 μm, and highest fracture energy of 1.4 J.
期刊介绍：
The Journal of Electronic Materials (JEM) reports monthly on the science and technology of electronic materials, while examining new applications for semiconductors, magnetic alloys, dielectrics, nanoscale materials, and photonic materials. The journal welcomes articles on methods for preparing and evaluating the chemical, physical, electronic, and optical properties of these materials. Specific areas of interest are materials for state-of-the-art transistors, nanotechnology, electronic packaging, detectors, emitters, metallization, superconductivity, and energy applications.
Review papers on current topics enable individuals in the field of electronics to keep abreast of activities in areas peripheral to their own. JEM also selects papers from conferences such as the Electronic Materials Conference, the U.S. Workshop on the Physics and Chemistry of II-VI Materials, and the International Conference on Thermoelectrics. It benefits both specialists and non-specialists in the electronic materials field.
A journal of The Minerals, Metals & Materials Society.
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