用于皮肤应用的非导电和导电可洗直链淀粉-胶泥粘合剂

George Al Boustani, Zhuoran Xu, Tetsuhiko F. Teshima, Lukas Bichlmaier, Marta Nikić, Lukas Hiendlmeier, August Sayn‐Wittgenstein, Defne Tüzün, Shigeyoshi Inoue, Bernhard Wolfrum
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引用次数: 0

摘要

报告研究了一种基于支链淀粉和胶泥的皮肤粘合剂,用于粘贴皮肤传感器。这种材料具有可靠的粘附性,同时由于直链淀粉复合物的亲水性,可以很容易地从皮肤上洗掉。评估了水和甘油含量对与聚酰亚胺基底相结合的粘附性能的影响,并优化了该材料的均匀性和可清洗性。结果表明,这种粘合材料在搭接剪切试验中可承受 88.7 ± 5.30 千帕的剪切应力。通过添加氯化钠,这种粘合材料还能轻松实现导电。对导电粘合材料进行了阻抗光谱分析,以评估其在 24 小时干燥条件下与商用电解质凝胶相比的阻抗行为。虽然导电粘合材料的初始阻抗略高于商用凝胶,但长期评估结果表明,随着时间的推移,其稳定性显著提高。总之,本研究开发了一种结合了支链淀粉和胶泥的皮肤粘合剂,显示出良好的粘合强度和导电性能,从而有可能解决皮肤传感器应用中目前存在的稳定性难题。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Non‐Conductive and Conductive Washable Amylopectin‐Mastic Gum Adhesives for On‐Skin Applications

Non‐Conductive and Conductive Washable Amylopectin‐Mastic Gum Adhesives for On‐Skin Applications
The investigation of a skin adhesive based on amylopectin and mastic gum for attaching skin sensors are reported. The material provides reliable adhesion and is, at the same time, readily washable from the skin due to the hydrophilic character of the amylopectin compound. The effect of water and glycerol content on the adhesion properties in combination with polyimide‐based substrates is assessed and optimize the material for homogeneous and washable on‐skin applications. This results show that the adhesive material can withstand a shear stress of 88.7 ± 5.30 kPa in a lap shear test. The adhesive material can also be easily rendered conductive by adding sodium chloride. Impedance spectroscopy is performed on the conductive adhesive material to assess the impedance behavior during drying conditions over 24 h in comparison to commercial electrolyte gel. While the conductive adhesion material's initial impedance is slightly higher than the commercial gel, the long‐term assessment demonstrates a significantly improved stability over time. In conclusion, this study develops a skin adhesive combining amylopectin and mastic gum, demonstrating promising adhesion strength and conductivity properties, thus potentially addressing current stability challenges in skin‐sensor applications.
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