Mohammed Hamid Mustafa, Hiba M. Ali, Nadir F. Habubi, B. H. Hussein
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引用次数: 0
摘要
利用化学喷雾热解在玻璃和 FTO 基底上沉积厚度为 250 纳米的氧化镍。在 523、623 和 723 K 等一系列退火温度下,对其特性进行了一小时的检测。根据 X 射线衍射测试,X 射线图案数据表明,氧化镍具有立方多晶结构,取向倾向于 (012)。薄膜表面非常光滑,原子力显微镜测量显示出纳米级结构。场发射扫描电子显微镜显示,沉积薄膜的颗粒大致呈球形,具有粒化和团聚趋势,大小形态均匀分散。沉积薄膜在 400 至 1100 nm 波长范围内的透射光谱被纳入光学特性的研究范围。吸收光谱率的降低导致光谱带隙(300-700 nm)上升了(3.21,3.28,3.31,3.35)eV。在不同退火温度下制作的异质结的电流-电压特性分析表明,当退火温度升高到 723 K 时,光电器件的转换效率从 1.9% 提高到 3.8%。
Influence of annealing on the optoelectronic properties of sprayed p-NiO/n-CdS
The chemical spray pyrolysis was utilized to deposit nickel oxide with a thickness of 250 nm on both glass and FTO substrates. Its characteristics were examined at a range of annealing temperatures, including 523, 623, and 723 K for one hour. Based on X-ray diffraction tests, The X-ray pattern data indicated that nickel oxide had a cubic polycrystalline structure with a favored orientation (012). The films have very smooth surfaces, and nanoscale structures were revealed using atomic force microscope measurements. Field-emission scanning electron microscope shows roughly spherical-shaped particles with granulation and an agglomeration tendency with uniformly dispersed size morphology for the deposited films. The deposited films’ transmittance spectrum of wavelengths between 400 and 1100 nm was included in the investigation of optical characteristics. The lowered absorption spectrum rate leads to the optical spectrum’s bandgap (300–700 nm) rise by (3.21,3.28,3.31,3.35) eV. Analysis of the current–voltage characteristics of heterojunctions fabricated at various annealing temperatures showed an increase in the conversion efficiency of the optoelectronic devices from 1.9 to 3.8% as the annealing temperature increased to 723 K.
期刊介绍:
The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.