通过掺杂 LMBS 玻璃降低 Mg4Nb2O9 微波陶瓷烧结温度的效果

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Qingang Shi, Jiafen Zhang, Juncheng Ma, Dawei Gao, Zhe Xiong, Xing Zhang, Bin Tang
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引用次数: 0

摘要

由于微波设备小型化和无线通信系统小型化的需求日益增长,具有优异微波介电特性的低温共烧陶瓷(LTCC)近来得到了广泛研究。Mg4Nb2O9 陶瓷以低介电损耗著称,适合应用于 5G/6G 技术。这项研究的重点是降低 Mg4Nb2O9 陶瓷的烧结温度,以满足 LTCC 技术的要求。结果表明,Li2O-MgO-B2O3-SO2(LMBS)玻璃具有良好的润湿性,可将 Mg4Nb2O9 陶瓷的烧结温度从 1350 ℃ 降低到 950 ℃。本文进一步研究了 Mg4Nb2O9 + x wt% LMBS 玻璃(x = 0、3、4、5、6)样品的相组成、微观结构、密度和微波介电性能。最终,Mg4Nb2O9 + 5 wt% LMBS 玻璃样品显示出ɛr = 12.16、Q × f = 45,273 GHz 和 τf = -75.3 ppm/°C 的微波介电性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Effect of lowering the sintering temperature in Mg4Nb2O9 microwave ceramic by doping LMBS glass

Effect of lowering the sintering temperature in Mg4Nb2O9 microwave ceramic by doping LMBS glass

Low-temperature co-fired ceramics (LTCC) with excellent microwave dielectric properties have been extensively studied recently due to the increasing demand for miniaturizing microwave devices and reducing the size of wireless communication systems. The Mg4Nb2O9 ceramic, known for its low dielectric loss, is suitable for applications in 5G/6G technology. This research focuses on lowering the sintering temperature of Mg4Nb2O9 ceramic to meet LTCC technology requirements. The results indicate that the Li2O–MgO–B2O3–SO2 (LMBS) glass demonstrates good wetting behavior and reduces the sintering temperature of Mg4Nb2O9 ceramic from 1350 °C to 950 °C. The phase composition, microstructures, densities, and microwave dielectric properties of Mg4Nb2O9 + x wt% LMBS glass (x = 0, 3, 4, 5, 6) samples are further investigated. Ultimately, the Mg4Nb2O9 + 5 wt% LMBS glass sample exhibits microwave dielectric properties with ɛr = 12.16, Q × f = 45,273 GHz, and τf = −75.3 ppm/°C.

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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