使用基底集成波导 (SIW) 的里布利特短槽耦合器，适用于高频应用

IF 0.6 Q3 MULTIDISCIPLINARY SCIENCES

Pertanika Journal of Science and Technology Pub Date : 2024-08-08 DOI:10.47836/pjst.32.5.08

N. Khalid, Siti Zuraidah Ibrahim, M. N. A Karim, Wee Fwen Hoon, A. Dewani, Khuzairi Masrakin, S. Azemi

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引用次数: 0

摘要

基板集成波导（SIW）是指将导电通孔浸入介质基板中，从而连接两块基板。本文介绍了一种新的基底集成波导技术，用于增强 Riblet 短槽耦合器的工作带宽。为了演示所提出的 SIW 技术，设计了两个 Riblet 短槽耦合器，并在两个不同的高频范围（Ku 波段和 K 波段）进行了研究。通过在耦合器侧壁中心引入多层 SIW 通孔，提高了拟议耦合器的带宽。采用这种方法可以最大限度地减少通孔之间的泄漏损耗，从而使 Ku 波段和 K 波段的整体工作带宽分别提高了 36.31% 和 26.32%。两个原型中的所有通孔都是用另一种方法实现的，没有使用电镀通孔印刷电路板（PTH-PCB）机器。此外，实验结果与模拟结果十分吻合。

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The Riblet Short-Slot Coupler Using Substrate Integrated Waveguide (SIW) for High-frequency Applications

Substrate Integrated Waveguide (SIW) involves the conductive via holes immersed in a dielectric substrate that connects two substrate plates. This article presents a new SIW technique to enhance the operational bandwidth of the Riblet Short-Slot coupler. To demonstrate the proposed SIW technique, two Riblet Short-Slot couplers are designed and investigated at two different high-frequency ranges, Ku-band and K-band. The bandwidth of the proposed couplers is improved by introducing multiple layers of SIW vias at the center of the couplers’ side wall. Applying this approach minimizes the leakage loss between vias, indicating an improved overall operating bandwidth of 36.31% and 26.32% for Ku-band and K-band, respectively. All vias in both prototypes are realized using an alternative method, without using the Plated-Through-Hole Printed-Circuit-Board (PTH-PCB) machine. In addition, experimental results agree well with the simulated results.

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来源期刊

Pertanika Journal of Science and Technology MULTIDISCIPLINARY SCIENCES-

CiteScore

1.50

自引率

16.70%

发文量

178

期刊介绍： Pertanika Journal of Science and Technology aims to provide a forum for high quality research related to science and engineering research. Areas relevant to the scope of the journal include: bioinformatics, bioscience, biotechnology and bio-molecular sciences, chemistry, computer science, ecology, engineering, engineering design, environmental control and management, mathematics and statistics, medicine and health sciences, nanotechnology, physics, safety and emergency management, and related fields of study.