用于增强电磁干扰屏蔽和机械热稳定性的多功能金属化刨花板

IF 3.1 2区 农林科学 Q1 FORESTRY
Qiang Guo, Yanfei Pan, Shuaiqi Hu, Long Qing, Yu Wang, Jintian Huang
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引用次数: 0

摘要

开发低成本、性能稳定、可大规模生产的多功能电磁干扰(EMI)屏蔽材料仍面临巨大挑战。高密度的传统金属限制了 EMI 屏蔽材料的应用。木材的独特结构被认为是解决上述问题的有效途径。本研究以废旧木材为原料,制备低能耗金属化刨花板。该刨花板经过功能性加工,具有优异的疏水性能,可在潮湿环境中稳定使用。 对刨花板进行了动态热机械性能和机械性能分析。弯曲强度(MOR)、弹性模量(MOE)和拉伸强度分别为 30.50 兆帕、5384 兆帕和 7.85 兆帕。金属化刨花板在整个 X 波段表现出优异的电磁屏蔽效果(EMI SE)(平均值为 81.62 dB)。木基屏蔽金属化刨花板的制备为替代传统金属材料提供了一种可行的策略。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Multifunctional metallized particleboard for enhanced electromagnetic interference shielding and mechanical thermal stability

Multifunctional metallized particleboard for enhanced electromagnetic interference shielding and mechanical thermal stability

The development of multifunctional electromagnetic interference (EMI) shielding materials with low cost, stable performance and mass production is still facing great challenges. High-density traditional metals limit the application of EMI shielding materials. The unique structure of wood is considered an effective way to solve the above-mentioned problems. In this study, waste wood was used as raw material to prepare low-energy metallized particleboard. The particleboard was functionally finished to show excellent hydrophobic properties and been used stably in a humid environment. Dynamic thermal mechanical properties and mechanical properties analyses of particleboard were carried out. The bend strength (MOR), elastic modulus (MOE) and tensile strength were 30.50 MPa, 5384 MPa and 7.85 MPa, respectively. Metallized particleboard exhibited excellent electromagnetic shielding effectiveness (EMI SE) (average value 81.62 dB) in the entire X-band. The preparation of wood-based shielding metallized particleboard provides a feasible strategy for replacing traditional metal materials.

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来源期刊
Wood Science and Technology
Wood Science and Technology 工程技术-材料科学:纸与木材
CiteScore
5.90
自引率
5.90%
发文量
75
审稿时长
3 months
期刊介绍: Wood Science and Technology publishes original scientific research results and review papers covering the entire field of wood material science, wood components and wood based products. Subjects are wood biology and wood quality, wood physics and physical technologies, wood chemistry and chemical technologies. Latest advances in areas such as cell wall and wood formation; structural and chemical composition of wood and wood composites and their property relations; physical, mechanical and chemical characterization and relevant methodological developments, and microbiological degradation of wood and wood based products are reported. Topics related to wood technology include machining, gluing, and finishing, composite technology, wood modification, wood mechanics, creep and rheology, and the conversion of wood into pulp and biorefinery products.
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