电子设备中氧化膜的介电击穿

IF 79.8 1区 材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY
Andrea Padovani, Paolo La Torraca, Jack Strand, Luca Larcher, Alexander L. Shluger
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引用次数: 0

摘要

介电击穿是指绝缘体的导电性因电应力而突然发生的灾难性增长。它是使用绝缘薄膜作为栅极绝缘体的电子设备以及能量和记忆电容器中的主要可靠性问题之一。尽管进行了广泛的研究,但我们对驱动击穿过程的物理机制的了解仍然不全面,而且描述介电击穿的原子模型也存在争议。本综述概述了不同绝缘材料介电击穿实验和理论研究积累的大量数据和知识,重点介绍现象学模型和新型计算方法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Dielectric breakdown of oxide films in electronic devices

Dielectric breakdown of oxide films in electronic devices

Dielectric breakdown of oxide films in electronic devices
Dielectric breakdown is a sudden and catastrophic increase in the conductivity of an insulator caused by electrical stress. It is one of the major reliability issues in electronic devices using insulating films as gate insulators and in energy and memory capacitors. Despite extensive studies, our understanding of the physical mechanisms driving the breakdown process remains incomplete, and atomistic models describing the dielectric breakdown are controversial. This Review surveys the enormous amount of data and knowledge accumulated from experimental and theoretical studies of dielectric breakdown in different insulating materials, focusing on describing phenomenological models and novel computational approaches. Dielectric breakdown is a major reliability issue in electronic devices. This Review discusses the data and knowledge accumulated from experimental and theoretical studies of dielectric breakdown in different insulating materials, with a focus on phenomenological models and novel computational approaches.
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来源期刊
Nature Reviews Materials
Nature Reviews Materials Materials Science-Biomaterials
CiteScore
119.40
自引率
0.40%
发文量
107
期刊介绍: Nature Reviews Materials is an online-only journal that is published weekly. It covers a wide range of scientific disciplines within materials science. The journal includes Reviews, Perspectives, and Comments. Nature Reviews Materials focuses on various aspects of materials science, including the making, measuring, modelling, and manufacturing of materials. It examines the entire process of materials science, from laboratory discovery to the development of functional devices.
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