电磁脉冲照射金属外壳薄片窗与薄丝网的高效建模方法

IF 2 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Qi-Feng Liu;Wan-Hu Wang;Xin Wang;Han Xiong;Xin Wang;Xue-Gui Zhu
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引用次数: 0

摘要

本文提出了一种子单元法,用于在有限差分时域(FDTD)方法中模拟带有细线网的电介质薄片。我们改进了薄片子单元法,使其不仅能模拟包括损耗在内的薄磁性和电性薄片,还能模拟带有一些细线网的薄材料。首先将 FDTD 结果与传输线理论方法在模拟电磁波通过无限材料薄片传播时的结果进行了比较。然后,使用所提出的子单元模型来模拟带有薄介质窗口的金属外壳。利用这些公式,应用所提出的 FDTD 算法分析了一些带有薄介质网观察窗的导电外壳在任意极化的大功率电磁脉冲作用下的屏蔽效果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The Efficient Modeling Method of Thin-Sheet Window With Thin-Wire Nets in the Metallic Enclosures Illuminated by an Electromagnetic Pulse
This article presents a subcell method for modeling electrically thin dielectric material sheets with thin-wire nets in the finite-difference time-domain (FDTD) method. We improved the thin-sheet subcell method to model not only a thin magnetic and electric sheet including loss, but also a thin material with some thin-wire nets. The FDTD results were first compared with the transmission line theory method results in modeling electromagnetic propagating through an infinite material sheet. Then, the proposed subcell model is used to model a metallic enclosure with a thin dielectric window. With these formulas, the proposed FDTD algorithm is applied to analyze the shielding effectiveness of some conductive enclosures with an observation window consisting of thin-weir nets in the presence of a high-power electromagnetic pulse with arbitrary polarization.
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来源期刊
CiteScore
4.80
自引率
19.00%
发文量
235
审稿时长
2.3 months
期刊介绍: IEEE Transactions on Electromagnetic Compatibility publishes original and significant contributions related to all disciplines of electromagnetic compatibility (EMC) and relevant methods to predict, assess and prevent electromagnetic interference (EMI) and increase device/product immunity. The scope of the publication includes, but is not limited to Electromagnetic Environments; Interference Control; EMC and EMI Modeling; High Power Electromagnetics; EMC Standards, Methods of EMC Measurements; Computational Electromagnetics and Signal and Power Integrity, as applied or directly related to Electromagnetic Compatibility problems; Transmission Lines; Electrostatic Discharge and Lightning Effects; EMC in Wireless and Optical Technologies; EMC in Printed Circuit Board and System Design.
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