S. Jasmee, Jose Palagud, Wang SW, K. I. Hoo, N. D. I. Masdzarif, T. S. Lim, G. Omar
{"title":"用于 CMOS iBGA 的金包银合金丝在不同电熄火和键合参数下的自由气球和键合性行为","authors":"S. Jasmee, Jose Palagud, Wang SW, K. I. Hoo, N. D. I. Masdzarif, T. S. Lim, G. Omar","doi":"10.1007/s10854-024-13221-z","DOIUrl":null,"url":null,"abstract":"<p>Au-coated Ag Alloys (ACA) have emerged as a new bonding wire in semiconductor industries with lower costs for CMOS iBGA applications. However, a wide gap of study, especially in terms of free air ball (FAB) formation, ball shear, pull test and intermetallic compound (IMC) phase, has left these areas unclear. This paper extensively studied FAB and morphology behaviours for 4N Au (AA) and ACA wire bonds at different EFO currents and EFO times. The bondability performance, ball shear, and wire pull tests were also conducted at the optimum setting of the EFO process and various bonding parameters. The results showed that the EFO current of 45 mA and EFO time of 0.37 ms (#ACA5) provided the best FAB size and morphology formed as predicted by the JMP Prediction profiler with maximum shear force and pulled test up to 0.34 N and 0.20 N at S1 and S2 Force of 0.74 N and 0.15 N, respectively as well as S2 Power of 60 mA and 70 mA. The IMC formed is recognised as Ag–Al (Ag<sub>2</sub>Al) and not Au-Al phase since the Au layer coated onto the Ag alloys is 2.5 ± 0.05 to 5 ± 0.07 μm only. The Vickers hardness obtained is almost similar to AA wires that descended the ball. No obvious ripples formed, unlike AA wires, which signified that the ACA wires may reach a good bondability as conventional wires.</p>","PeriodicalId":646,"journal":{"name":"Journal of Materials Science: Materials in Electronics","volume":null,"pages":null},"PeriodicalIF":2.8000,"publicationDate":"2024-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Free air ball and bondability behaviours of Au-coated Ag alloy wire at various electro flame-off and bonding parameters for CMOS iBGA\",\"authors\":\"S. Jasmee, Jose Palagud, Wang SW, K. I. Hoo, N. D. I. Masdzarif, T. S. Lim, G. Omar\",\"doi\":\"10.1007/s10854-024-13221-z\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<p>Au-coated Ag Alloys (ACA) have emerged as a new bonding wire in semiconductor industries with lower costs for CMOS iBGA applications. However, a wide gap of study, especially in terms of free air ball (FAB) formation, ball shear, pull test and intermetallic compound (IMC) phase, has left these areas unclear. This paper extensively studied FAB and morphology behaviours for 4N Au (AA) and ACA wire bonds at different EFO currents and EFO times. The bondability performance, ball shear, and wire pull tests were also conducted at the optimum setting of the EFO process and various bonding parameters. The results showed that the EFO current of 45 mA and EFO time of 0.37 ms (#ACA5) provided the best FAB size and morphology formed as predicted by the JMP Prediction profiler with maximum shear force and pulled test up to 0.34 N and 0.20 N at S1 and S2 Force of 0.74 N and 0.15 N, respectively as well as S2 Power of 60 mA and 70 mA. The IMC formed is recognised as Ag–Al (Ag<sub>2</sub>Al) and not Au-Al phase since the Au layer coated onto the Ag alloys is 2.5 ± 0.05 to 5 ± 0.07 μm only. The Vickers hardness obtained is almost similar to AA wires that descended the ball. No obvious ripples formed, unlike AA wires, which signified that the ACA wires may reach a good bondability as conventional wires.</p>\",\"PeriodicalId\":646,\"journal\":{\"name\":\"Journal of Materials Science: Materials in Electronics\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":2.8000,\"publicationDate\":\"2024-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Materials Science: Materials in Electronics\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.1007/s10854-024-13221-z\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Materials Science: Materials in Electronics","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1007/s10854-024-13221-z","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
摘要
金包银合金(ACA)已成为半导体工业中一种新的键合丝,在 CMOS iBGA 应用中成本更低。然而,对这些领域的研究,尤其是对自由空气球(FAB)形成、球剪切、拉力测试和金属间化合物(IMC)阶段的研究还存在很大差距。本文广泛研究了 4N 金(AA)和 ACA 金属丝键合在不同 EFO 电流和 EFO 时间下的 FAB 和形态行为。在 EFO 过程的最佳设置和各种键合参数下,还进行了键合性能、球剪切和线拉测试。结果表明,45 mA 的 EFO 电流和 0.37 ms 的 EFO 时间(#ACA5)提供了 JMP 预测剖面仪预测的最佳 FAB 尺寸和形态,在 S1 和 S2 力分别为 0.74 N 和 0.15 N 以及 S2 功率分别为 60 mA 和 70 mA 时,最大剪切力和拉力测试分别达到 0.34 N 和 0.20 N。由于镀在银合金上的金层只有 2.5 ± 0.05 至 5 ± 0.07 μm,因此形成的 IMC 被认为是银-铝(Ag2Al)相,而不是金-铝相。所获得的维氏硬度与从球上垂下的 AA 金属丝几乎相似。与 AA 金属丝不同的是,ACA 金属丝没有形成明显的波纹,这表明 ACA 金属丝与传统金属丝一样具有良好的粘合性。
Free air ball and bondability behaviours of Au-coated Ag alloy wire at various electro flame-off and bonding parameters for CMOS iBGA
Au-coated Ag Alloys (ACA) have emerged as a new bonding wire in semiconductor industries with lower costs for CMOS iBGA applications. However, a wide gap of study, especially in terms of free air ball (FAB) formation, ball shear, pull test and intermetallic compound (IMC) phase, has left these areas unclear. This paper extensively studied FAB and morphology behaviours for 4N Au (AA) and ACA wire bonds at different EFO currents and EFO times. The bondability performance, ball shear, and wire pull tests were also conducted at the optimum setting of the EFO process and various bonding parameters. The results showed that the EFO current of 45 mA and EFO time of 0.37 ms (#ACA5) provided the best FAB size and morphology formed as predicted by the JMP Prediction profiler with maximum shear force and pulled test up to 0.34 N and 0.20 N at S1 and S2 Force of 0.74 N and 0.15 N, respectively as well as S2 Power of 60 mA and 70 mA. The IMC formed is recognised as Ag–Al (Ag2Al) and not Au-Al phase since the Au layer coated onto the Ag alloys is 2.5 ± 0.05 to 5 ± 0.07 μm only. The Vickers hardness obtained is almost similar to AA wires that descended the ball. No obvious ripples formed, unlike AA wires, which signified that the ACA wires may reach a good bondability as conventional wires.
期刊介绍:
The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.