聚氯乙烯火灾烟雾环境中无铅焊料腐蚀动力学预测模型

IF 4.7 1区 材料科学 Q1 METALLURGY & METALLURGICAL ENGINEERING
Qian LI, Jin LIN, Meng-ke ZHAO, Chang-hai LI, Shou-xiang LU
{"title":"聚氯乙烯火灾烟雾环境中无铅焊料腐蚀动力学预测模型","authors":"Qian LI,&nbsp;Jin LIN,&nbsp;Meng-ke ZHAO,&nbsp;Chang-hai LI,&nbsp;Shou-xiang LU","doi":"10.1016/S1003-6326(24)66542-8","DOIUrl":null,"url":null,"abstract":"<div><p>The corrosion kinetics, surface microstructure, and corrosion mechanism of Sn−3.0Ag lead-free solder were investigated using mass-loss method in the temperature range from 283.15 to 323.15 K in polyvinyl chloride fire smoke environment. The results show that the Sn−3.0Ag solder exhibits an increase in mass-loss from (22.09±2.01) to (44.66±1.20) g/m<sup>2</sup> as the temperature increases from 283.15 to 323.15 K. Moreover, the corrosion kinetics is in accordance with Arrhenius law. The surface corrosion products of Sn−3.0Ag solder show a superposition growth trend. At 283.15 K, the surface of Sn−3.0Ag solder shows significant corrosion products. The corrosion process of Sn−3.0Ag lead-free solder is an electrochemical corrosion. Hydrogen evolution and oxygen abstraction reactions occur in the cathode, and the dissolution of the Sn-rich phase occurs in the anode. The corrosion products are Sn<sub>21</sub>Cl<sub>16</sub>(OH)<sub>14</sub>O<sub>6</sub>, SnO<sub>2</sub>, and SnO.</p></div>","PeriodicalId":23191,"journal":{"name":"Transactions of Nonferrous Metals Society of China","volume":"34 7","pages":"Pages 2304-2312"},"PeriodicalIF":4.7000,"publicationDate":"2024-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.sciencedirect.com/science/article/pii/S1003632624665428/pdf?md5=5a9aff8c6e9367f9ab0b0d768bba594c&pid=1-s2.0-S1003632624665428-main.pdf","citationCount":"0","resultStr":"{\"title\":\"Predictive model of corrosion kinetics for lead-free solder in polyvinyl chloride fire smoke environment\",\"authors\":\"Qian LI,&nbsp;Jin LIN,&nbsp;Meng-ke ZHAO,&nbsp;Chang-hai LI,&nbsp;Shou-xiang LU\",\"doi\":\"10.1016/S1003-6326(24)66542-8\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>The corrosion kinetics, surface microstructure, and corrosion mechanism of Sn−3.0Ag lead-free solder were investigated using mass-loss method in the temperature range from 283.15 to 323.15 K in polyvinyl chloride fire smoke environment. The results show that the Sn−3.0Ag solder exhibits an increase in mass-loss from (22.09±2.01) to (44.66±1.20) g/m<sup>2</sup> as the temperature increases from 283.15 to 323.15 K. Moreover, the corrosion kinetics is in accordance with Arrhenius law. The surface corrosion products of Sn−3.0Ag solder show a superposition growth trend. At 283.15 K, the surface of Sn−3.0Ag solder shows significant corrosion products. The corrosion process of Sn−3.0Ag lead-free solder is an electrochemical corrosion. Hydrogen evolution and oxygen abstraction reactions occur in the cathode, and the dissolution of the Sn-rich phase occurs in the anode. The corrosion products are Sn<sub>21</sub>Cl<sub>16</sub>(OH)<sub>14</sub>O<sub>6</sub>, SnO<sub>2</sub>, and SnO.</p></div>\",\"PeriodicalId\":23191,\"journal\":{\"name\":\"Transactions of Nonferrous Metals Society of China\",\"volume\":\"34 7\",\"pages\":\"Pages 2304-2312\"},\"PeriodicalIF\":4.7000,\"publicationDate\":\"2024-07-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://www.sciencedirect.com/science/article/pii/S1003632624665428/pdf?md5=5a9aff8c6e9367f9ab0b0d768bba594c&pid=1-s2.0-S1003632624665428-main.pdf\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Transactions of Nonferrous Metals Society of China\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S1003632624665428\",\"RegionNum\":1,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"METALLURGY & METALLURGICAL ENGINEERING\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Transactions of Nonferrous Metals Society of China","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1003632624665428","RegionNum":1,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"METALLURGY & METALLURGICAL ENGINEERING","Score":null,"Total":0}
引用次数: 0

摘要

采用质量损失法研究了在聚氯乙烯火灾烟雾环境中,温度范围为 283.15 至 323.15 K 的锡-3.0Ag 无铅焊料的腐蚀动力学、表面微观结构和腐蚀机理。结果表明,随着温度从 283.15 K 上升到 323.15 K,锡-3.0Ag 焊料的质量损失从(22.09±2.01)g/m2 增加到(44.66±1.20)g/m2。锡-3.0Ag 焊料的表面腐蚀产物呈叠加增长趋势。在 283.15 K 时,锡-3.0Ag 焊料的表面出现了明显的腐蚀产物。锡-3.0Ag 无铅焊料的腐蚀过程属于电化学腐蚀。阴极发生氢进化和氧抽取反应,阳极发生富锡相溶解。腐蚀产物为 Sn21Cl16(OH)14O6、SnO2 和 SnO。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Predictive model of corrosion kinetics for lead-free solder in polyvinyl chloride fire smoke environment

The corrosion kinetics, surface microstructure, and corrosion mechanism of Sn−3.0Ag lead-free solder were investigated using mass-loss method in the temperature range from 283.15 to 323.15 K in polyvinyl chloride fire smoke environment. The results show that the Sn−3.0Ag solder exhibits an increase in mass-loss from (22.09±2.01) to (44.66±1.20) g/m2 as the temperature increases from 283.15 to 323.15 K. Moreover, the corrosion kinetics is in accordance with Arrhenius law. The surface corrosion products of Sn−3.0Ag solder show a superposition growth trend. At 283.15 K, the surface of Sn−3.0Ag solder shows significant corrosion products. The corrosion process of Sn−3.0Ag lead-free solder is an electrochemical corrosion. Hydrogen evolution and oxygen abstraction reactions occur in the cathode, and the dissolution of the Sn-rich phase occurs in the anode. The corrosion products are Sn21Cl16(OH)14O6, SnO2, and SnO.

求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
CiteScore
7.40
自引率
17.80%
发文量
8456
审稿时长
3.6 months
期刊介绍: The Transactions of Nonferrous Metals Society of China (Trans. Nonferrous Met. Soc. China), founded in 1991 and sponsored by The Nonferrous Metals Society of China, is published monthly now and mainly contains reports of original research which reflect the new progresses in the field of nonferrous metals science and technology, including mineral processing, extraction metallurgy, metallic materials and heat treatments, metal working, physical metallurgy, powder metallurgy, with the emphasis on fundamental science. It is the unique preeminent publication in English for scientists, engineers, under/post-graduates on the field of nonferrous metals industry. This journal is covered by many famous abstract/index systems and databases such as SCI Expanded, Ei Compendex Plus, INSPEC, CA, METADEX, AJ and JICST.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信