复合绝缘体鞘芯棒界面的温度效应:分子动力学和 DFT 研究

IF 1.9 4区 材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY
Jun Xie, Longyin Qiao, Ziqian Liu, Xiaoyu Shi, Ping Huang
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引用次数: 0

摘要

复合绝缘体的工作状态在很大程度上受到鞘-棒界面的影响。在这项研究中,我们通过分子建模,同时考虑密度泛函理论(DFT)和分子动力学(MD),研究了温度对鞘-棒体系的影响。该体系的界面自由体积、HOMO/LUMO、氢键数量、键序、质量中心距和其他特征决定了其降解机制。研究结果表明,温度升高有可能增加界面自由体积和质量中心距离,并显著减少氢键数量。此外,DFT 模拟显示,界面间的键合强度和非键合力随着温度的升高而减弱。高温显著提高了环氧树脂和硅橡胶链的反应活性,表明系统对某些入侵者的反应将受到温度升高的催化。这项工作从微观角度研究了护套-芯棒界面降解的温度依赖性,这对提高复合绝缘体的整体性能非常重要。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Temperature effects on the sheath-core bar interface of compositeinsulators: a molecular dynamics and DFT study
The functioning condition of composite insulators is greatly influenced by the sheath-mandrel interface. In this work, the effects of temperature on the sheath-mandrel system are examined using molecular modeling, taking into account both density functional theory (DFT) and molecular dynamics (MD). The system's interfacial free volume, HOMO/LUMO, number of hydrogen bonds, bond order, center-of-mass distance, and other characteristics define its degradation mechanism. The findings demonstrate that elevated temperatures have the potential to increase the interfacial free volume, the center-of-mass distance, and significantly reduce the number of hydrogen bonds. In addition, DFT simulations show that the bonding strength and non-bonding forces between the interfaces weaken with increasing temperature.High temperatures significantly boost the reactivity of the epoxy resin and silicone rubber chains, indicating that the system's response with some intruders will be catalyzed by the temperature increase.This work looks at the temperature dependence of the sheath-core bar interface degradation from a microscopic perspective, which is important for enhancing the overall performance of composite insulators.
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来源期刊
CiteScore
3.30
自引率
5.60%
发文量
96
审稿时长
1.7 months
期刊介绍: Serving the multidisciplinary materials community, the journal aims to publish new research work that advances the understanding and prediction of material behaviour at scales from atomistic to macroscopic through modelling and simulation. Subject coverage: Modelling and/or simulation across materials science that emphasizes fundamental materials issues advancing the understanding and prediction of material behaviour. Interdisciplinary research that tackles challenging and complex materials problems where the governing phenomena may span different scales of materials behaviour, with an emphasis on the development of quantitative approaches to explain and predict experimental observations. Material processing that advances the fundamental materials science and engineering underpinning the connection between processing and properties. Covering all classes of materials, and mechanical, microstructural, electronic, chemical, biological, and optical properties.
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