评估纹理尺寸和滚圆工艺对晶体硅晶片三维柔性的影响

Koki Ide, Tappei Nishihara, Kyotaro Nakamura, Yoshio Ohshita, Tomoyuki Kawatsu, Toshiki Nagai, Noboru Yamada, Trang Phuong Pham, Atsushi Ogura
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引用次数: 0

摘要

汽车有望成为太阳能电池的一个新应用领域。由于汽车车身具有复杂的三维曲面,旨在提高空气动力性能,因此需要能够安装在这些曲面上的柔性太阳能电池。为此,研究的重点是具有高转换效率和可靠性的单晶硅太阳能电池,因为硅晶片越薄,柔韧性越好。以往的研究报告指出,为改善硅晶片表面的光吸收而采用的纹理结构会影响三维柔性。在这项工作中,我们进行了环上球测试,以确定纹理尺寸和滚圆处理如何影响晶体硅晶片的柔性,并测量其柔性。结果表明,滚圆处理增加了柔性,而纹理尺寸减小则提高了柔性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Evaluation of the effect of texture size and rounding process on 3-dimensional flexibility of c-Si wafer
Vehicles are expected to be a new application field for solar cells. Since vehicle bodies have complicated three-dimensional curved surfaces designed to improve aerodynamic performance, there is a need for flexible solar cells that can be installed on such surfaces. To this end, research has focused on single-crystalline Si solar cells with high conversion efficiency and reliability, since the flexibility of Si wafers improves as they become thinner. Previous studies have reported that the texture structure to improve the light absorption on the Si wafer surface affects the three-dimensional flexibility. In this work, we perform a Ball-on-Ring test to determine how texture size and rounding treatment affect the flexibility of c-Si wafers and measure the flexibility. The results demonstrate that the rounding process increases flexibility, while the texture size reduction improves flexibility.
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