Thomas Hanemann, Alexander Klein, Heinz Walter, David Wilhelm, Steffen Antusch
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引用次数: 0
摘要
注塑模具镶件的快速模具制造可以实现非常快速的产品开发和高度定制化的设计。为此,应将快速成型方法与合适的聚合物材料(如高性能热塑性聚合物聚醚醚酮 (PEEK))相结合。基于材料挤压(MEX)的三维打印需要超过 400 °C 的高加工温度,而熔融长丝制造(FFF)则需要对打印参数进行更复杂的研究。在这项工作中,我们评估了合适的 MEX 打印策略(包括打印温度和速度等打印参数),以实现两种不同的模具镶件表面几何形状,并检查了由此产生的打印质量。作为概念验证,采用了陶瓷注射成型进行复制。在考虑了两种不同的测试结构后,陶瓷原料可以成功复制并达到可接受的质量,而模具镶件不会出现明显的劣化。
Evaluation of Material Extrusion Printed PEEK Mold Inserts for Usage in Ceramic Injection Molding
The rapid tooling of mold inserts for injection molding allows for very fast product development, as well as a highly customized design. For this, a combination of rapid prototyping methods with suitable polymer materials, like the high-performance thermoplastic polymer polyetheretherketone (PEEK), should be applied. As a drawback, a huge processing temperature beyond 400 °C is necessary for material extrusion (MEX)-based 3D printing; here, Fused Filament Fabrication (FFF) requires a more sophisticated printing parameter investigation. In this work, suitable MEX printing strategies, covering printing parameters like printing temperature and speed, for the realization of two different mold insert surface geometries were evaluated, and the resulting print quality was inspected. As a proof of concept, ceramic injection molding was used for replication. Under consideration of the two different test structures, the ceramic feedstock could be replicated successfully and to an acceptable quality without significant mold insert deterioration.
期刊介绍:
ACS Applied Electronic Materials is an interdisciplinary journal publishing original research covering all aspects of electronic materials. The journal is devoted to reports of new and original experimental and theoretical research of an applied nature that integrate knowledge in the areas of materials science, engineering, optics, physics, and chemistry into important applications of electronic materials. Sample research topics that span the journal's scope are inorganic, organic, ionic and polymeric materials with properties that include conducting, semiconducting, superconducting, insulating, dielectric, magnetic, optoelectronic, piezoelectric, ferroelectric and thermoelectric.
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