以纳米晶碳化硅为例,深入了解硅太阳能电池溅射损伤背后的机理

Alexander Eberst, Binbin Xu, Karsten Bittkau, Weiyuan Duan, Andreas Lambertz, Ansgar Meise, Marc Heggen, Rafal E. Dunin-Borkowski, Uwe Rau, Kaining Ding
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引用次数: 0

摘要

透明导电氧化物(如铟锡氧化物)可实现硅异质结太阳能电池中电荷载流子的横向传输。然而,它们的沉积会破坏太阳能电池的钝化质量。溅射沉积过程中的这种损害是一个复杂的问题,尤其是在非晶硅、多晶硅或纳米晶碳化硅等各种硅基材料中,尚未得到充分理解。在非晶硅等材料中观察到的钝化质量下降不仅可以用紫外线降解来解释。本研究以氢化纳米晶碳化硅为例,结合模拟和实验分析,探讨了这种降解的根源。研究深入探讨了溅射过程中的潜在损伤源,并确定等离子体发光或电子轰击的主要或次要效应都不可能导致损伤。同样,离子植入、空位产生和晶格原子电离也被认为是不可能的原因。不过,有人提出,通过声子向晶体硅界面传递能量可能是导致钝化质量下降的因素之一。这种转移可能是溅射过程中在钝化层中观察到的损坏的一个合理解释。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Deeper Insight into the Mechanisms Behind Sputter Damage in Silicon Solar Cells Based on the Example of Nanocrystalline Silicon Carbide

Deeper Insight into the Mechanisms Behind Sputter Damage in Silicon Solar Cells Based on the Example of Nanocrystalline Silicon Carbide

Transparent conducting oxides, like indium tin oxide, enable lateral charge carrier transport in silicon heterojunction solar cells. However, their deposition can damage the passivation quality in the solar cell. This damage during the sputter deposition is a complex issue that has not been fully understood, particularly in various silicon-based materials like amorphous silicon, polycrystalline silicon, or nanocrystalline silicon carbide. The degradation in passivation quality observed in, for example, amorphous silicon is not only explainable by UV light degradation. This study explores the origin of this degradation based on the example of hydrogenated nanocrystalline silicon carbide by combining simulations with experimental analyses. It delves into potential sources of damage during the sputtering process and determines that neither primary nor secondary effects from plasma luminescence or electron bombardment are likely contributors to the damage. Similarly, the implantation of ions, as well as the creation of vacancies and ionization of lattice atoms, are also considered improbable causes. It is, however, proposed that the transfer of energy to the crystalline silicon interface via phonons can factor into the degradation of the passivation quality. This transfer might be a plausible explanation for the damage observed in the passivation layers during the sputtering process.

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