在挤压工艺中进行叠印时补偿基底缺陷的工作流程

IF 3.3 Q2 ENGINEERING, MANUFACTURING
Fynn Atzler, Simon Hümbert, Heinz Voggenreiter
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引用次数: 0

摘要

熔融颗粒制造(FGF)在工业应用中被用来在短时间内制造复杂部件,并降低成本。最近,人们开始讨论对连续纤维增强层压板进行叠印,以生产高性能的功能性结构。为了实现这种方法,开发了一种将 FGF 与自动纤维铺放(AFP)相结合的混合工艺,在这种工艺中,添加剂制造的结构被原位粘合到热塑性层压板上。然而,这种组合对过程控制提出了很高的要求,尤其是在第一层打印层上。在层压板上进行三维打印时,第一层打印层的高度对粘接的剪切强度起着决定性作用。层压板在制造过程中产生的表面缺陷,如热翘曲、间隙和胶带重叠等,会导致几何形状偏离理想状态,从而影响粘接强度。因此,本研究提出了一种新的工艺流程,利用层压板的三维扫描来调整快速成型结构的几何形状,从而在三维打印中实现恒定的层高,进而获得恒定的机械性能。在上述表面缺陷中,只有热翘曲对粘接强度有显著影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A Workflow for the Compensation of Substrate Defects When Overprinting in Extrusion-Based Processes
Fused granular fabrication (FGF) is used in industrial applications to manufacture complex parts in a short time frame and with reduced costs. Recently, the overprinting of continuous fibre-reinforced laminates has been discussed to produce high-performance, functional structures. A hybrid process combining FGF with Automated Fibre Placement (AFP) was developed to implement this approach, where an additively manufactured structure is bonded in situ onto a thermoplastic laminate. However, this combination places great demands on process control, especially in the first printing layer. When 3D printing onto a laminate, the height of the first printed layer is decisive to the shear strength of the bonding. Manufacturing-induced surface defects of a laminate, like thermal warpage, gaps, and tape overlaps, can result in deviations from the ideal geometry and thus impair the bonding strength when left uncompensated. This study, therefore, proposes a novel process flow that uses a 3D scan of a laminate to adjust the geometry of the additively manufactured structure to achieve a constant layer height in the 3D print and, thus, constant mechanical properties. For the above-listed surface defects, only thermal warpage was found to have a significant effect on the bonding strength.
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来源期刊
Journal of Manufacturing and Materials Processing
Journal of Manufacturing and Materials Processing Engineering-Industrial and Manufacturing Engineering
CiteScore
5.10
自引率
6.20%
发文量
129
审稿时长
11 weeks
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