使用挤压和烧结技术对铜零件进行增材制造:评估打印参数和排胶方法的影响

A. Pellegrini, F. Lavecchia, M. G. Guerra
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引用次数: 0

摘要

设计/方法/途径 使用含铜量为 90 Wt.% 的高填充长丝,改变打印速度和流速,实现九种不同的组合。随后分别在 483 °C 和 1057 °C 下进行热脱脂和烧结,将样品埋入特定的耐火粉末和碳中。测量了生坯密度和烧结密度,并用光学显微镜对缺陷进行了详细的内部分析。研究结果表明,生坯密度值最高的样品,由于在热脱胶过程中夹带的聚合物产生了明显的膨胀缺陷,因此在烧结状态下的生坯密度最差。另一方面,绿色密度值较低的零件可以达到令人满意的密度值,且没有明显的外部缺陷。 原创性/价值通过基于激光的增材制造技术实现铜零件,会遇到一些与快速传热和铜的高反射率有关的问题,这阻碍了对激光功率的吸收。而 MEX+D&S 则成为实现铜零件的一种更简便、更经济的替代方案。对样品的内部检查表明,有必要对工艺链进行改进,采用不同的排胶工艺,在热排胶过程中打开通道,以避免聚合物堵塞。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Additive manufacturing of copper parts using extrusion and sinter-based technology: evaluation of the influence of printing parameters and debinding method
Purpose This work is focused on the realization of copper parts using the material extrusion additive manufacturing debinding and sintering (MEX+D&S) technology. Design/methodology/approach A highly filled filament with 90 Wt.% of copper is used to realize nine different combinations varying the printing speed and the flow rate. The following thermal debinding and sintering are performed at 483 °C and 1057 °C, respectively, burying the samples in specific refractory powder and carbon. The green and sintered density are measured and an inspection at optical microscope is implemented for a detailed internal analysis of the defects. Findings The samples, that reported the highest values of the green density, become the worst in the sintered condition due to evident swelling defect generated by the entrapped polymer during the thermal debinding. On the other hand, the parts with the lower values of green density allowed to achieve a satisfying density value without significant external defects. Originality/value The realization of copper parts through laser-based additive manufacturing technologies shows several troubles related to the rapid heat transfer and the high reflectivity of copper, which is a hinder of the absorption of the laser power. The MEX+D&S becomes an easier and economical alternative for the realization of copper parts. The internal inspection of the samples revealed the need for the improvement on the process chain, adopting a different debinding process to open channels during the thermal debinding to avoid the entrapment of the polymer.
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