利用溅射中子辐照对 4.5 kV Si IGBT 进行大气中子诱发的单次烧毁表征

Chao Peng, Liu Yang, Zhifeng Lei, Yuebin Zhou, Teng Ma, Zhiyong Yuan, Zhangang Zhang, Yujuan He, Yun Huang
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引用次数: 0

摘要

通过对具有沟槽栅极结构的 4.5 kV Si IGBT 进行溅射中子源辐照,观察到了大气中子诱发的单次烧毁(SEB)。SEB 表现为随机失效,与偏置电压密切相关。根据实验结果计算了两种不同硅 IGBT 在不同偏置电压下的 SEB 失效率。结果表明,失效率随偏置电压呈指数增长。对于两种不同的 IGBT,当偏置电压为额定电压的 60% 时,在海拔 4000 米处大气中子诱发的失效率分别为 0.855 FIT 和 4.39 FIT。当偏置电压增加到额定电压的 64% 时,相应的故障率分别增加到 24.7 FIT 和 47.6 FIT。此外,还通过 TCAD 仿真研究了硅 IGBT 的 SEB 机制。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Atmospheric Neutron-induced Single Event Burnout Characterization of 4.5 kV Si IGBTs with Spallation Neutron Irradiation
The atmospheric neutron-induced single event burnout (SEB) is observed for 4.5 kV Si IGBTs with trench gate structure by conducting spallation neutron source irradiation. The SEB is manifested as a random failure and is strongly related to the bias voltage. The SEB failure rates of two different Si IGBTs at different bias voltages are calculated based on the experimental results. It shows that the failure rates increase exponentially with bias voltages. For two different kinds of IGBTs, the atmospheric neutron-induced failure rate at an altitude of 4000 m is 0.855 FIT and 4.39 FIT, respectively, when biased at 60% of the rated voltage. When the bias voltage is increased to 64% of the rated voltage, the corresponding failure rates are increased to 24.7 FIT and 47.6 FIT. Furthermore, the SEB mechanisms for Si IGBTs are investigated by TCAD simulations.
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