Temperature and strain rate-dependent compression properties of 3D-printed PLA: an experimental and modeling analysis

Purpose This study aims to investigate the compression characteristics of the 3D-printed polylactic acid (PLA) samples at temperatures below the glass transition temperature (Tg) with varying strain rates and develop a thermo-mechanical viscoplastic constitutive model to predict the finite strain compression response using a single set of material parameters. Also, the micro-mechanical damage processes are linked to the global stress–strain response at varied strain rates and temperatures through scanning electron microscopy (SEM). Design/methodology/approach Tg of PLA was determined using a dynamic mechanical analyzer. Compression experiments were conducted at strain rates of 2 × 10–3/s and 2 × 10–2/s at 25°C, 40°C and 50°C. The failure mechanisms were examined using SEM. A finite strain thermo-mechanical viscoplastic constitutive model was developed to analyze the deformations at the considered strain rates and temperatures. Findings Tg of PLA was determined as 55°C. While the yield and post-yield stresses drop with increasing temperature, their trend reverses with an increased strain rate. SEM imaging indicated plasticizing effects at higher temperatures, while filament fragmentation and twisting at higher strain rates were identified as the dominant failure mechanisms. Using a non-linear regression analysis to predict the experimental data, an overall R2 value of 0.98 was achieved between experimental and model prediction, implying the robustness of the model’s calibration. Originality/value In this study, a viscoplastic constitutive model was developed that considers the combined effect of temperature and strain rate for FDM-printed PLA experiencing extensive compression. Using appropriate temperature-dependent modulus and flow rate properties, a single set of model parameters predicted the rise in the gap between yield stress and degree of softening as strain rates and temperatures increased.