液态金属栅格图案化薄膜设备,实现以吸收为主、应变可调的电磁干扰屏蔽。

IF 26.6 1区 材料科学 Q1 Engineering
Yuwen Wei, Priyanuj Bhuyan, Suk Jin Kwon, Sihyun Kim, Yejin Bae, Mukesh Singh, Duy Thanh Tran, Minjeong Ha, Kwang-Un Jeong, Xing Ma, Byeongjin Park, Sungjune Park
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引用次数: 0

摘要

下一代可穿戴和微型软电子设备对高性能薄膜形可变形电磁干扰(EMI)屏蔽器件的需求日益增长。虽然高反射导电材料能有效屏蔽电磁干扰,但由于其刚性会阻止器件变形,同时还会产生二次电磁污染。本文介绍了具有以吸收为主的 EMI 屏蔽行为的软质可拉伸 EMI 屏蔽薄膜器件。该器件由液态金属(LM)层和 LM 网格图案层组成,中间由一层薄弹性体薄膜隔开,利用气溶胶沉积的 LM 在弹性体上的优异附着力制造而成。由于 LM 网格结构中产生的多重内部反射诱发了电磁干扰吸收,因此这些器件具有高电磁屏蔽效能(SE)(SET 高达 75 dB)和低反射率(谐振频率下的 SER 为 1.5 dB)。值得注意的是,基于 LM 的器件具有出色的可拉伸性,可通过应变时的栅格空间调整实现可调的 EMI 屏蔽能力(应变 33% 时谐振频率从 81.3 GHz 变为 71.3 GHz),即使在多次应变周期后也能保持屏蔽效果。这种新开发的器件为下一代智能电子产品提供了一种先进的范例,可实现强大的 EMI 屏蔽性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Liquid Metal Grid Patterned Thin Film Devices Toward Absorption-Dominant and Strain-Tunable Electromagnetic Interference Shielding

Liquid Metal Grid Patterned Thin Film Devices Toward Absorption-Dominant and Strain-Tunable Electromagnetic Interference Shielding
  • Multiple internal reflection-based absorption-dominant stretchable electromagnetic shielding thin film by incorporating liquid metal grid structure is developed.

  • The device demonstrates high electromagnetic shielding effectiveness (SE) (SET of up to 75 dB) with low reflectance (SER of 1.5 dB at the resonant frequency).

  • The shielding properties of the device can be tuned by adjusting the liquid metal patterned grid spaces upon strain.

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来源期刊
Nano-Micro Letters
Nano-Micro Letters NANOSCIENCE & NANOTECHNOLOGY-MATERIALS SCIENCE, MULTIDISCIPLINARY
CiteScore
32.60
自引率
4.90%
发文量
981
审稿时长
1.1 months
期刊介绍: Nano-Micro Letters is a peer-reviewed, international, interdisciplinary, and open-access journal published under the SpringerOpen brand. Nano-Micro Letters focuses on the science, experiments, engineering, technologies, and applications of nano- or microscale structures and systems in various fields such as physics, chemistry, biology, material science, and pharmacy.It also explores the expanding interfaces between these fields. Nano-Micro Letters particularly emphasizes the bottom-up approach in the length scale from nano to micro. This approach is crucial for achieving industrial applications in nanotechnology, as it involves the assembly, modification, and control of nanostructures on a microscale.
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