Curvature programming of freestanding 3D mesostructures and flexible electronics based on bilayer ribbon networks

Three-dimensional (3D) buckling assembly of flexible electronics from strategically designed two-dimensional (2D) precursor structures has enabled important applications in a variety of areas, owing to its versatile applicability to a broad range of length scales and high-performance materials, as well as to a rich diversity of 3D topologies. Rational design methods that allow direct mapping of 3D mesostructures onto unknown 2D precursor structures and loading parameters are foundational to these assembly technologies, but face scientific challenges, such as the high nonlinearity of spatial deformations and tricky bifurcation behaviors. While a few inverse design methods based on the beam theory, topology optimization and machine learning algorithms have been reported, the shape programming of freestanding 3D mesostructures/electronics with highly complex curvature distributions remains elusive. In this work, we propose a curvature programming method based on bilayer ribbon networks, along with a mold-assisted assembly strategy, as a new route to customizable freestanding 3D mesostructures and electronics. Combined mechanics modeling, finite element analyses and experimental measurements allow a clear understanding of nonlinear bending-stretching coupled deformations of bilayer ribbon networks during the 2D-to-3D transformation. A parameter domain with one-to-one mapping of the dimensionless curvature and the bending stiffness ratio is identified, offering a theoretical basis of the curvature programming. By introducing a discretization strategy, a variety of regular (e.g., circles, ellipses, spirals and toroids) and biomimetic 3D curved ribbons and mesosurfaces (e.g., mimicking wavy vines, diatoms and arbitrarily curled leaves) were inversely designed and experimentally realized. A device demonstration capable of strain/temperature sensing and micro-LEDs indication suggests application opportunities in bioelectronics and microelectromechanical systems.