{"title":"电容器劣化情况下 MMC 的热平衡方法","authors":"Zan Jia, Yongjie Luo, Qianggang Wang, Niancheng Zhou, Yonghui Song, Qifen Li","doi":"10.1016/j.ijepes.2024.110113","DOIUrl":null,"url":null,"abstract":"<div><p>Thermal control of semiconductor devices in the submodules (SMs) is a key factor for the safe and reliable operation of modular multilevel converters (MMCs). During normal operation, significant thermal differences can arise among SMs due to the manufacturing tolerance and aging effect of capacitors, which can affect the lifespan of semiconductor devices and even lead to equipment failure. To address the problem, this paper presents a method for achieving thermal balancing among SMs with different capacitances by adjusting their switching principle. Firstly, the relationship between the degree of capacitance degradation and the junction temperature difference among SMs is revealed. Then, by setting data windows to capture the dynamic losses of power devices, which can reflect the trend of junction temperature. The switching principle of thermal balance among SMs is studied based on the trend of junction temperature in power devices. The thermal balancing method has advantages including not requiring high-precision temperature sensors and eliminating the reliance on capacitance monitoring technology. Finally, the simulation and experimentation results demonstrate that the proposed method can effectively achieve balanced junction temperatures of power devices among different SMs.</p></div>","PeriodicalId":50326,"journal":{"name":"International Journal of Electrical Power & Energy Systems","volume":null,"pages":null},"PeriodicalIF":5.0000,"publicationDate":"2024-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.sciencedirect.com/science/article/pii/S014206152400334X/pdfft?md5=214abc97b9f5d21dbcb75542d4c0c74e&pid=1-s2.0-S014206152400334X-main.pdf","citationCount":"0","resultStr":"{\"title\":\"A thermal balancing method for MMCs under capacitor deterioration\",\"authors\":\"Zan Jia, Yongjie Luo, Qianggang Wang, Niancheng Zhou, Yonghui Song, Qifen Li\",\"doi\":\"10.1016/j.ijepes.2024.110113\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>Thermal control of semiconductor devices in the submodules (SMs) is a key factor for the safe and reliable operation of modular multilevel converters (MMCs). During normal operation, significant thermal differences can arise among SMs due to the manufacturing tolerance and aging effect of capacitors, which can affect the lifespan of semiconductor devices and even lead to equipment failure. To address the problem, this paper presents a method for achieving thermal balancing among SMs with different capacitances by adjusting their switching principle. Firstly, the relationship between the degree of capacitance degradation and the junction temperature difference among SMs is revealed. Then, by setting data windows to capture the dynamic losses of power devices, which can reflect the trend of junction temperature. The switching principle of thermal balance among SMs is studied based on the trend of junction temperature in power devices. The thermal balancing method has advantages including not requiring high-precision temperature sensors and eliminating the reliance on capacitance monitoring technology. Finally, the simulation and experimentation results demonstrate that the proposed method can effectively achieve balanced junction temperatures of power devices among different SMs.</p></div>\",\"PeriodicalId\":50326,\"journal\":{\"name\":\"International Journal of Electrical Power & Energy Systems\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":5.0000,\"publicationDate\":\"2024-07-10\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://www.sciencedirect.com/science/article/pii/S014206152400334X/pdfft?md5=214abc97b9f5d21dbcb75542d4c0c74e&pid=1-s2.0-S014206152400334X-main.pdf\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"International Journal of Electrical Power & Energy Systems\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S014206152400334X\",\"RegionNum\":2,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal of Electrical Power & Energy Systems","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S014206152400334X","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
摘要
子模块(SM)中半导体器件的热控制是模块化多电平转换器(MMC)安全可靠运行的关键因素。在正常运行期间,由于制造公差和电容器的老化效应,子模块(SM)之间可能会出现明显的热差异,从而影响半导体器件的使用寿命,甚至导致设备故障。针对这一问题,本文提出了一种通过调整开关原理实现不同电容的 SM 之间热平衡的方法。首先,揭示了电容衰减程度与 SM 之间结温差的关系。然后,通过设置数据窗口捕捉功率器件的动态损耗,从而反映结温的变化趋势。根据功率器件结温的变化趋势,研究了 SM 间热平衡的开关原理。热平衡方法具有无需高精度温度传感器、无需依赖电容监测技术等优点。最后,仿真和实验结果表明,所提出的方法能有效实现不同 SM 之间功率器件结温的平衡。
A thermal balancing method for MMCs under capacitor deterioration
Thermal control of semiconductor devices in the submodules (SMs) is a key factor for the safe and reliable operation of modular multilevel converters (MMCs). During normal operation, significant thermal differences can arise among SMs due to the manufacturing tolerance and aging effect of capacitors, which can affect the lifespan of semiconductor devices and even lead to equipment failure. To address the problem, this paper presents a method for achieving thermal balancing among SMs with different capacitances by adjusting their switching principle. Firstly, the relationship between the degree of capacitance degradation and the junction temperature difference among SMs is revealed. Then, by setting data windows to capture the dynamic losses of power devices, which can reflect the trend of junction temperature. The switching principle of thermal balance among SMs is studied based on the trend of junction temperature in power devices. The thermal balancing method has advantages including not requiring high-precision temperature sensors and eliminating the reliance on capacitance monitoring technology. Finally, the simulation and experimentation results demonstrate that the proposed method can effectively achieve balanced junction temperatures of power devices among different SMs.
期刊介绍:
The journal covers theoretical developments in electrical power and energy systems and their applications. The coverage embraces: generation and network planning; reliability; long and short term operation; expert systems; neural networks; object oriented systems; system control centres; database and information systems; stock and parameter estimation; system security and adequacy; network theory, modelling and computation; small and large system dynamics; dynamic model identification; on-line control including load and switching control; protection; distribution systems; energy economics; impact of non-conventional systems; and man-machine interfaces.
As well as original research papers, the journal publishes short contributions, book reviews and conference reports. All papers are peer-reviewed by at least two referees.