Safia Bedre-dine, Yasmin Binti Ahmad Feisal, Tiphaine Lucas, David Grenier
{"title":"利用部分真空降低双层扁面包的烘烤温度","authors":"Safia Bedre-dine, Yasmin Binti Ahmad Feisal, Tiphaine Lucas, David Grenier","doi":"10.1016/j.jfoodeng.2024.112201","DOIUrl":null,"url":null,"abstract":"<div><p>The delamination of layers (or ‘puffing’ effect) in flatbreads is mainly governed by heat transfer encouraging manufacturers and small-scale bakers to bake at high temperatures (up to 350 °C) and apply direct heat. The use of high baking temperatures to achieve delamination of layers during baking has raised concerns regarding excessive energy consumption, as well as considerations of food quality and safety. This study investigated use of a partial vacuum to enhance the double layering of flatbreads at low temperatures (160 and 200 °C) and for different dough thicknesses (2 and 4 mm). Temperature probes and camera were used to monitor the dynamics of deformation and energy transfer under a partial vacuum. To complement this evaluation, final quality attributes (water content, texture test, color and alkaline water retention capacity) were then analyzed for the most promising baking profiles. It is clearly demonstrated by this study that double-layered flatbread can be successfully par-baked or baked at 200 °C through the application of low pressure (∼50 kPa) to 2 mm thick dough. The role of the partial vacuum in bringing about an earlier boiling point is highlighted, which could boost the evaporative flow, complementing the direct effects of low pressure on gas expansion and desolubilization, and facilitate the delamination of layers.</p></div>","PeriodicalId":359,"journal":{"name":"Journal of Food Engineering","volume":null,"pages":null},"PeriodicalIF":5.3000,"publicationDate":"2024-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.sciencedirect.com/science/article/pii/S026087742400267X/pdfft?md5=4d63d29ade23e3f11684be4e648afd10&pid=1-s2.0-S026087742400267X-main.pdf","citationCount":"0","resultStr":"{\"title\":\"Use of partial vacuum to decrease the baking temperature of double-layered flatbread\",\"authors\":\"Safia Bedre-dine, Yasmin Binti Ahmad Feisal, Tiphaine Lucas, David Grenier\",\"doi\":\"10.1016/j.jfoodeng.2024.112201\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>The delamination of layers (or ‘puffing’ effect) in flatbreads is mainly governed by heat transfer encouraging manufacturers and small-scale bakers to bake at high temperatures (up to 350 °C) and apply direct heat. The use of high baking temperatures to achieve delamination of layers during baking has raised concerns regarding excessive energy consumption, as well as considerations of food quality and safety. This study investigated use of a partial vacuum to enhance the double layering of flatbreads at low temperatures (160 and 200 °C) and for different dough thicknesses (2 and 4 mm). Temperature probes and camera were used to monitor the dynamics of deformation and energy transfer under a partial vacuum. To complement this evaluation, final quality attributes (water content, texture test, color and alkaline water retention capacity) were then analyzed for the most promising baking profiles. It is clearly demonstrated by this study that double-layered flatbread can be successfully par-baked or baked at 200 °C through the application of low pressure (∼50 kPa) to 2 mm thick dough. The role of the partial vacuum in bringing about an earlier boiling point is highlighted, which could boost the evaporative flow, complementing the direct effects of low pressure on gas expansion and desolubilization, and facilitate the delamination of layers.</p></div>\",\"PeriodicalId\":359,\"journal\":{\"name\":\"Journal of Food Engineering\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":5.3000,\"publicationDate\":\"2024-06-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://www.sciencedirect.com/science/article/pii/S026087742400267X/pdfft?md5=4d63d29ade23e3f11684be4e648afd10&pid=1-s2.0-S026087742400267X-main.pdf\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Food Engineering\",\"FirstCategoryId\":\"97\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S026087742400267X\",\"RegionNum\":2,\"RegionCategory\":\"农林科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"ENGINEERING, CHEMICAL\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Food Engineering","FirstCategoryId":"97","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S026087742400267X","RegionNum":2,"RegionCategory":"农林科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, CHEMICAL","Score":null,"Total":0}
Use of partial vacuum to decrease the baking temperature of double-layered flatbread
The delamination of layers (or ‘puffing’ effect) in flatbreads is mainly governed by heat transfer encouraging manufacturers and small-scale bakers to bake at high temperatures (up to 350 °C) and apply direct heat. The use of high baking temperatures to achieve delamination of layers during baking has raised concerns regarding excessive energy consumption, as well as considerations of food quality and safety. This study investigated use of a partial vacuum to enhance the double layering of flatbreads at low temperatures (160 and 200 °C) and for different dough thicknesses (2 and 4 mm). Temperature probes and camera were used to monitor the dynamics of deformation and energy transfer under a partial vacuum. To complement this evaluation, final quality attributes (water content, texture test, color and alkaline water retention capacity) were then analyzed for the most promising baking profiles. It is clearly demonstrated by this study that double-layered flatbread can be successfully par-baked or baked at 200 °C through the application of low pressure (∼50 kPa) to 2 mm thick dough. The role of the partial vacuum in bringing about an earlier boiling point is highlighted, which could boost the evaporative flow, complementing the direct effects of low pressure on gas expansion and desolubilization, and facilitate the delamination of layers.
期刊介绍:
The journal publishes original research and review papers on any subject at the interface between food and engineering, particularly those of relevance to industry, including:
Engineering properties of foods, food physics and physical chemistry; processing, measurement, control, packaging, storage and distribution; engineering aspects of the design and production of novel foods and of food service and catering; design and operation of food processes, plant and equipment; economics of food engineering, including the economics of alternative processes.
Accounts of food engineering achievements are of particular value.